AD8224-EVALZ Analog Devices Inc, AD8224-EVALZ Datasheet - Page 9

• Manufacturer Part Number: AD8224-EVALZ
• Description: BOARD EVALUATION AD8224
• Manufacturer: Analog Devices Inc

Specifications of AD8224-EVALZ

• Channels Per Ic: 2 - Dual
• Amplifier Type: Instrumentation
• Output Type: Single-Ended, Rail-to-Rail
• Slew Rate: 2 V/µs
• -3db Bandwidth: 1.5MHz
• Current - Output / Channel: 15mA
• Operating Temperature: -40°C ~ 85°C
• Current - Supply (main Ic): 750µA
• Voltage - Supply, Single/dual (±): 4.5 V ~ 36 V, ±2.25 V ~ 18 V
• Board Type: Fully Populated
• Utilized Ic / Part: AD8224
• Silicon Manufacturer: Analog Devices
• Application Sub Type: JFET Input Instrumentation Amplifier
• Kit Application Type: Amplifier
• Silicon Core Number: AD8224
• Kit Contents: Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter
Supply Voltage
Power Dissipation
Output Short-Circuit Current
Input Voltage (Common Mode)
Differential Input Voltage
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Package Glass Transition Temperature
ESD (Human Body Model)
ESD (Charge Device Model)
ESD (Machine Model)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1
2
Assumes the load is referenced to midsupply.
Temperature for
to 125°C, see the
specified performance is −40°C to +
Typical Performance Characteristics
2
85°C. For performance
section.
Rating
±18 V
See Figure 2
Indefinite
±V
±V
−65°C to +130°C
−40°C to +125°C
300°C
130°C
130°C
4 kV
1 kV
0.4 kV
S
S
1
Rev. B | Page 9 of 28
THERMAL RESISTANCE
Table 9.
Exposed Paddle Package
CP-16-13: LFCSP Soldered to Board
CP-16-13: LFCSP Not Soldered to Board
Table 10.
Hidden Paddle Package
CP-16-19: LFCSP
The θ
standard board. If the thermal pad is soldered to the board, it is
also assumed it is connected to a plane. θ
4.4°C/W.
Maximum Power Dissipation
The maximum safe power dissipation for the AD8224 is limited
by the associated rise in junction temperature (T
approximately 130°C, which is the glass transition temperature,
the plastic changes its properties. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the amplifiers. Exceeding a temperature of 130°C for an
extended period can result in a loss of functionality. Figure 2
shows the maximum safe power dissipation in the package vs.
the ambient temperature for the LFCSP on a 4-layer JEDEC
standard board.
ESD CAUTION
Figure 2. Maximum Power Dissipation vs. Ambient Temperature
JA
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
values in Table 9 and Table 10 assume a 4-layer JEDEC
0
–60
θ
IS NOT SOLDERED TO BOARD
JA
–40
= 86°C/W WHEN THERMAL PAD
–20
AMBIENT TEMPERATURE (°C)
0
θ
IS SOLDERED TO BOARD
JA
20
= 48°C/W WHEN THERMAL PAD
40
60
JC
80
at the exposed pad is
θ
86
θ
86
48
JA
JA
100
J
) on the die. At
120
AD8224
Unit
°C/W
°C/W
Unit
°C/W
140