NCP1230GEVB ON Semiconductor, NCP1230GEVB Datasheet - Page 20

EVAL BOARD FOR NCP1230G

NCP1230GEVB

Manufacturer Part Number
NCP1230GEVB
Description
EVAL BOARD FOR NCP1230G
Manufacturer
ON Semiconductor
Datasheets

Specifications of NCP1230GEVB

Design Resources
NCP1230 EVB BOM NCP1230GEVB Gerber Files NCP1230 EVB Schematic
Main Purpose
AC/DC, Primary Side
Outputs And Type
1, Isolated
Power - Output
90W
Voltage - Output
18.6V
Current - Output
4.74A
Voltage - Input
85 ~ 265VAC
Regulator Topology
Flyback
Frequency - Switching
47kHz
Board Type
Fully Populated
Utilized Ic / Part
NCP1230
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With/related Products
NCP1230G
Other names
NCP1230GEVBOS
−Z−
−Y−
B
H
−X−
8
1
0.25 (0.010)
G
A
D
4
5
M
Z
S
Y
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
C
0.25 (0.010)
X
SEATING
PLANE
S
0.024
0.10 (0.004)
0.6
0.275
M
7.0
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
Y
http://onsemi.com
M
N
CASE 751−07
X 45
D SUFFIX
ISSUE AJ
SOIC−8
_
M
20
K
SCALE 6:1
0.060
0.155
1.52
4.0
1.270
0.050
J
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751−07.
DIM
A
B
C
D
G
H
K
M
N
S
J
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
0
0.050 BSC
INCHES
_
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX
8
_

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