ADP2107-EVALZ Analog Devices Inc, ADP2107-EVALZ Datasheet - Page 6

• Manufacturer Part Number: ADP2107-EVALZ
• Description: BOARD EVALUATION FOR ADP2107
• Manufacturer: Analog Devices Inc

Specifications of ADP2107-EVALZ

• Main Purpose: DC/DC, Step Down
• Outputs And Type: 1, Non-Isolated
• Voltage - Output: 2.5V
• Current - Output: 2A
• Voltage - Input: 2.7 ~ 5.5V
• Regulator Topology: Buck
• Frequency - Switching: 1.2MHz
• Board Type: Fully Populated
• Utilized Ic / Part: ADP2107
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -

ADP2105/ADP2106/ADP2107
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
IN, EN, SS, COMP, FB to AGND
LX1, LX2 to PGND
PWIN1, PWIN2 to PGND
PGND to AGND
GND to AGND
PWIN1, PWIN2 to IN
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rating
−0.3 V to +6 V
−0.3 V to (V
−0.3 V to +6 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
IN
+ 0.3 V)
Rev. C | Page 6 of 36
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
16-Lead LFCSP_VQ/QFN
Maximum Power Dissipation
BOUNDARY CONDITION
Natural convection, 4-layer board, exposed pad soldered to the PCB.
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
40
1
JA
Unit
°C/W
W