DEMOTS4956J STMicroelectronics, DEMOTS4956J Datasheet - Page 50

• Manufacturer Part Number: DEMOTS4956J
• Description: BOARD DEMO TS4956EIJT/EIKJT
• Manufacturer: STMicroelectronics

Specifications of DEMOTS4956J

• Amplifier Type: Class AB
• Output Type: 1-Channel (Mono) with Mono and Stereo Headphones
• Max Output Power X Channels @ Load: 1W x 1 @ 8 Ohm; 43mW x 2 @ 32 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Board Type: Fully Populated
• Utilized Ic / Part: TS4956
• Description/function: Audio Amplifiers
• Operating Supply Voltage: 2.7 V to 5.5 V
• Product: Audio Modules
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: TS4956
• Other names: 497-6381; DEMOTS4956J

TS4956
5
5.1
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
18-bump flip-chip package
Figure 132. 18-bump flip-chip package
Figure 133. Footprint recommendations
750μm
750μm
Non Solder mask opening
Non Solder mask opening
500μm
500μm
®
®
packages, depending on their level of environmental compliance. ECOPACK
is an ST trademark.
Φ=250μm
Φ=250μm
Φ=400μm
Φ=400μm
866μm
866μm
2500 μm
2500 μm
866μm
866μm
Pad in Cu 18μm with Flash NiAu (2-6μm, 0.2μm max)
Pad in Cu 18μm with Flash NiAu (2-6μm, 0.2μm max)
500μm
500μm
2400 μm
2400 μm
600 μm
600 μm
40 μm*
40 μm*
Die size: 2.5 x 2.4 mm ± 30 µm
Die height (including bumps): 600 µm
Bumps diameter: 315 µm ±50 µm
Bump diameter before reflow: 300 µm
±10 µm
Bumps height: 250 µm ±40 µm
Die height: 350 µm ±20 µm
Pitch: 500 µm ±50 µm
Coplanarity: 50 µm max
Optional*: back coating height: 40 µm
500μm
500μm
Package information
150μm min.
150μm min.
75µm min.
75µm min.
100μm max.
100μm max.
Track
Track
50/55
®