CP2400DK Silicon Laboratories Inc, CP2400DK Datasheet - Page 28

• Manufacturer Part Number: CP2400DK
• Description: KIT EVAL SPI LCD DRIVER CP2400
• Manufacturer: Silicon Laboratories Inc

Specifications of CP2400DK

• Main Purpose: LCD Development
• Embedded: Yes
• Utilized Ic / Part: CP2400
• Primary Attributes: I²C, SMBus Interfaces
• Secondary Attributes: Up to 128 segments
• Product: Microcontroller Modules
• Core Processor: C8051F930
• Clock Speed: 20 MHz
• Interface Type: SPI
• Timers: 2
• Operating Supply Voltage: 1.8 V to 3.6 V
• Cpu Core: C8051F930
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
• Other names: 336-1858; 336-1858

CP2400/1/2/3
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Notes:
General:
Solder Mask Design:
Stencil Design:
Card Assembly:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
Figure 4.10. TQFP-48 Recommended PCB Land Pattern
the solder mask and the metal pad is to be 60 µm minimum, all the way around
the pad.
should be used to assure good solder paste release.
specification for Small Body Components.
Table 4.3. TQFP-48 PCB Land Pattern Dimensions
Dimension
C1
C2
X1
Y1
E
Rev. 1.0
8.30
8.30
0.20
1.40
Min
0.50 BSC
Max
8.40
8.40
0.30
1.50