LTM4603HVEV#PBF Linear Technology, LTM4603HVEV#PBF Datasheet - Page 17

• Manufacturer Part Number: LTM4603HVEV#PBF
• Description: IC DC/DC UMODULE 6A 118-LGA
• Manufacturer: Linear Technology
• Series: µModuler
• Type: Point of Load (POL) Non-Isolatedr

Specifications of LTM4603HVEV#PBF

• Design Resources: LTM4603HV Spice Model
• Output: 0.6 ~ 5 V
• Number Of Outputs: 1
• Power (watts): 30W
• Mounting Type: Surface Mount
• Voltage - Input: 4.5 ~ 28 V
• Package / Case: 118-LGA
• 1st Output: 0.6 ~ 5 VDC @ 6A
• Size / Dimension: 0.59" L x 0.59" W x 0.11" H (15mm x 15mm x 2.8mm)
• Power (watts) - Rated: 30W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 93%
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -

APPLICATIO S I FOR ATIO
Table 3. 1.5V Output
Table 4. 3.3V Output
Heat Sink Manufacturer
Wakefi eld Engineering
DERATING CURVE
DERATING CURVE
Figures 10, 12
Figures 10, 12
Figures 10, 12
Figures 13, 15
Figures 13, 15
Figures 13, 15
Figures 14, 16
Figures 14, 16
Figures 14, 16
Figures 9, 11
Figures 9, 11
Figures 9, 11
U
U
5, 12, 20
5, 12, 20
5, 12, 20
V
V
12, 24
12, 24
12, 24
12, 24
12, 24
12, 24
5, 12
5, 12
5, 12
IN
IN
(V)
(V)
W
Part No: 20069
POWER LOSS CURVE
POWER LOSS CURVE
Figure 7
Figure 7
Figure 7
Figure 7
Figure 7
Figure 7
Figure 8
Figure 8
Figure 8
Figure 8
Figure 8
Figure 8
U
AIR FLOW (LFM)
AIR FLOW (LFM)
200
400
200
400
200
400
200
400
0
0
0
0
Phone: [phone]
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
HEAT SINK
HEAT SINK
None
None
None
None
None
None
LTM4603HV
θ
θ
JA
JA
10.25
15.2
13.9
11.3
15.2
14.6
13.4
13.9
11.1
10.5
(°C/W)
14
12
(°C/W)
17
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