JAHW050F1 Lineage Power, JAHW050F1 Datasheet - Page 16

• Manufacturer Part Number: JAHW050F1
• Description: CONVERTER DC/DC 3.3V 33W OUT
• Manufacturer: Lineage Power
• Series: JAHWr
• Type: Isolated with Remote On/Offr

Specifications of JAHW050F1

• Output: 3.3V
• Number Of Outputs: 1
• Power (watts): 33W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: 9-DIP Module
• 1st Output: 3.3 VDC @ 10A
• Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61mm x 57.9mm x 12.7mm)
• Power (watts) - Rated: 33W
• Operating Temperature: -40°C ~ 100°C
• Efficiency: 88%
• Approvals: CE, CSA, UL, VDE
• Product: Isolated
• Output Power: 33 W
• Input Voltage Range: 36 V to 75 V
• Output Voltage (channel 1): 3.3 V
• Output Current (channel 1): 10 A
• Isolation Voltage: 1.5 KV
• Package / Case Size: DIP
• Output Type: Isolated
• Output Voltage: 3.3 V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -
• Lead Free Status / Rohs Status: No

JAHW050F, JAHW075F, and JAHW100F Power Modules:
Data Sheet
dc-dc Converters; 36 to 75 Vdc Input, 3.3 Output; 33 W to 66 W
April 2008
Through-Hole Lead-Free Soldering Infor-
mation
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant components.
They are designed to be processed through single or dual
wave soldering machines. The pins have an RoHS-compli-
ant finish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of 3°C/s is
suggested. The wave preheat process should be such that
the temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot temperature is
260°C, while the Pb-free solder pot is 270°C max. Not all
RoHS-compliant through-hole products can be processed
with paste-through-hole Pb or Pb-free reflow process. If addi-
tional information is needed, please consult with your Lineage
Electronics Power System representative for more details.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Lineage
Power Board Mounted Power Modules: Soldering and
Cleaning Application Note (AP01-056EPS).
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Lineage Power