CC30-2405SFH-E TDK Corporation, CC30-2405SFH-E Datasheet - Page 10

• Manufacturer Part Number: CC30-2405SFH-E
• Description: CONV DC/DC 24V 5V 6A 30W PCB
• Manufacturer: TDK Corporation
• Series: CC-P-Er
• Type: Isolatedr

Specifications of CC30-2405SFH-E

• Output: 5V
• Number Of Outputs: 1
• Power (watts): 30W
• Mounting Type: Through Hole
• Voltage - Input: 24V
• Package / Case: 20-DIP Module (17 Leads)
• 1st Output: 5 VDC @ 6A
• Size / Dimension: 1.51" L x 1.32" W x 0.33" H (38.4mm x 33.5mm x 8.3mm)
• Power (watts) - Rated: 30W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 89%
• Approvals: CSA, cUL, EN, UL
• Dc / Dc Converter O/p Type: Fixed
• No. Of Outputs: 1
• Input Voltage: 18V To 36V
• Power Rating: 30W
• Output Voltage: 5V
• Output Current: 6A
• Approval Bodies: CULus, CSA
• Supply Voltage: 24V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

5. Soldering Conditions / Cleaning Condi
5. Soldering Conditions / Cleaning Conditions / Installation Method
5-1 Soldering Conditions
【DIP Model】
Perform soldering of the converter to the board according to the conditions shown in Table 5-1.
【SMD Model】
Lead free solder / high temperature reflow process conditions are shown in Figure 5-1.
5-2 Washing Conditions
We do not recommend board cleaning after soldering, we recommend not performing cleaning, but when cleaning becomes
necessary, perform it according to the conditions shown in Table 5-2
※Contact TDK-Lambda concerning items not mentioned or items which are not clear.
5. Soldering Conditions / Cleaning Condi
5. Soldering Conditions / Cleaning Condi
Soldering is to be performed only one time per pin.
The number of times permitted for reflow is 1 time.
225
Ty2
Ty1
TP
Isopropyl Alcohol
Cleaning Fluid
A
Fig. 5-1 Reflow Process Conditions for SMD Models
Table 5-2 Cleaning Fluid and Test Conditions
Table 5-1 Solder Conditions for DIP Models
ハンダ付け時間（s)
A '
Solder Iron
Solder Dip
Method
Cold Bath Cleaning R.T
Ultrasonic Wave 60℃
Vapor Cleaning 83℃
tions / Installation Method
tions / Installation Method
tions / Installation Method
B
Cleaning Method
B '
260℃ 10 sec Max.
C
380℃ 3 sec Max.
Condition
A '
B '
A
B
C
60 sec.
60 sec.
60 sec.
Time
Ty1～Ty2：20～100sec
225℃以上：20～40sec
-1.0～-5.0℃/sec
TP：MAX 245℃
Ty1：150±10℃
Ty2：170±10℃
1.0～3.0℃/sec
1.0～4.0℃/sec