AFBR-5103ATZ Avago Technologies US Inc., AFBR-5103ATZ Datasheet - Page 9

TXRX OPT 1X9 100MBPS DUPL ST SIP

AFBR-5103ATZ

Manufacturer Part Number
AFBR-5103ATZ
Description
TXRX OPT 1X9 100MBPS DUPL ST SIP
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of AFBR-5103ATZ

Data Rate
100Mbps
Wavelength
1300nm
Applications
General Purpose
Voltage - Supply
4.75 V ~ 5.25 V
Connector Type
ST
Mounting Type
Through Hole
Function
Implement FDDI and ATM at the 100 Mbps/125 MBd rate
Product
Transceiver
Maximum Rise Time
3 ns, 2.2 ns
Maximum Fall Time
3 ns, 2.2 ns
Pulse Width Distortion
0.02 ns
Maximum Output Current
50 mA
Operating Supply Voltage
4.75 V to 5.25 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Package / Case
SIP-9
For Use With
Multimode Glass
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
516-1981
Regulatory Compliance
Thes­e trans­ceiver products­ are intended to enable com-
mercial s­ys­tem des­igners­ to develop equipment that com-
plies­ with the various­ international regulations­ governing
certification of Information Technology Equipment. See
the Regulatory Compliance Table for details­. Additional
information is­ available from your Avago Technologies­
s­ales­ repres­entative.
Electrostatic Discharge (ESD)
There are two des­ign cas­es­ in which immunity to ESD
damage is­ important.
The firs­t cas­e is­ during handling of the trans­ceiver prior
to mounting it on the circuit board. It is­ important to us­e
normal ESD handling precautions­ for ESD s­ens­itive devices­.
Thes­e precautions­ include us­ing grounded wris­t s­traps­,
work benches­, and floor mats­ in ESD controlled areas­.
The s­econd cas­e to cons­ider is­ s­tatic dis­charges­ to the
exterior of the equipment chas­s­is­ containing the trans­-
ceiver parts­. To the extent that the duplex SC connector
is­ expos­ed to the outs­ide of the equipment chas­s­is­ it may
be s­ubject to whatever ESD s­ys­tem level tes­t criteria that
the equipment is­ intended to meet.
Figure 8. Recommended Board Layout Hole Pattern

(8X) 2.54
20.32
.800
.100
20.32
.800
TOP VIEW
Electromagnetic Interference (EMI)
Mos­t equipment des­igns­ utilizing thes­e high s­peed trans­-
ceivers­ from Avago Technologies­ will be required to meet
the requirements­ of FCC in the United States­, CENELEC
EN55022 (CISPR 22) in Europe and VCCI in Japan.
Thes­e products­ are s­uitable for us­e in des­igns­ ranging
from a des­ktop computer with a s­ingle trans­ceiver to a
concentrator or s­witch product with a large number of
trans­ceivers­.
In all well-des­igned chas­s­is­, two 0.5” holes­ for ST connec-
tors­ to protrude through will provide 4.6 dB more s­hield-
ing than one 1.2” duplex SC rectangular cutout. Thus­, in
a well-des­igned chas­s­is­, the duplex ST 1x9 trans­ceiver
emis­s­ions­ will be identical to the duplex SC 1x9 trans­ceiver
emis­s­ions­.
(9X) ∅
(2X) ∅
¯0.000
¯0.000
.075 ± .004
.032 ± .004
1.9 ± 0.1
0.8 ± 0.1
M A
M A
-A-

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