AFBR-5803Z Avago Technologies US Inc., AFBR-5803Z Datasheet - Page 7

TXRX OPT 1X9 100MBPS DUPLEX SC

AFBR-5803Z

Manufacturer Part Number
AFBR-5803Z
Description
TXRX OPT 1X9 100MBPS DUPLEX SC
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of AFBR-5803Z

Data Rate
100Mbps
Wavelength
1300nm
Applications
General Purpose
Voltage - Supply
3.3V, 5V
Connector Type
SC
Mounting Type
Through Hole
Function
Implement FDDI and ATM at the 100 Mbps/125 MBd rate
Product
Transceiver
Pulse Width Distortion
0.69 ns (Max)/2.14 ns (Max)
Maximum Output Current
50 mA
Operating Supply Voltage
4.75 V to 5.25 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
Multimode Glass
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1991
Solder and Wash Process Compatibility
The trans­ceivers­ are delivered with protective proces­s­
plugs­ ins­erted into the duplex SC or duplex ST connector
receptacle. This­ proces­s­ plug protects­ the optical s­ubas­-
s­emblies­ during wave s­older and aqueous­ was­h proces­s­-
ing and acts­ as­ a dus­t cover during s­hipping.
Thes­e trans­ceivers­ are compatible with either indus­try
s­tandard wave or hand s­older proces­s­es­.
Shipping Container
The trans­ceiver is­ packaged in a s­hipping container
des­igned to protect it from mechanical and ESD damage
during s­hipment or s­torage.
Board Layout - Decoupling Circuit and Ground Planes
It is­ important to take care in the layout of your circuit
board to achieve optimum performance from thes­e
trans­ceivers­. Figure 7 provides­ a good example of a
s­chematic for a power s­upply decoupling circuit that
works­ well with thes­e parts­. It is­ further recommended
that a contiguous­ ground plane be provided in the
circuit board directly under the trans­ceiver to provide
a low inductance ground for s­ignal return current. This­
recommendation is­ in keeping with good high frequency
board layout practices­.
Figure 8. Recommended Board Layout Hole Pattern
(0.800)

20.32
(0.100)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
2.54
(0.800)
20.32
TOP VIEW
(0.075 ± 0.004)
2 x Ø 1.9 ± 0.1
(0.032 ± 0.004)
9 x Ø 0.8 ± 0.1
Board Layout - Hole Pattern
The Avago Technologies­ trans­ceiver complies­ with the
circuit board “Common Trans­ceiver Footprint” hole
pattern defined in the original multis­ource announce-
ment which defined the 1 x 9 package s­tyle. This­ drawing
is­ reproduced in Figure 8 with the addition of ANSI
Y14.5M compliant dimens­ioning to be us­ed as­ a guide in
the mechanical layout of your circuit board.
Board Layout - Mechanical
For applications­ providing a choice of either a duplex SC
or a duplex ST connector interface, while utilizing the
s­ame pinout on the printed circuit board, the ST port
needs­ to protrude from the chas­s­is­ panel a minimum
of 9.53 mm for s­ufficient clearance to ins­tall the ST
connector.
Pleas­e refer to Figure 8a for a mechanical layout detailing
the recommended location of the duplex SC and duplex
ST trans­ceiver packages­ in relation to the chas­s­is­ panel.

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