MT4VDDT1664HY-335F3 Micron Technology Inc, MT4VDDT1664HY-335F3 Datasheet - Page 10
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MT4VDDT1664HY-335F3
Manufacturer Part Number
MT4VDDT1664HY-335F3
Description
MODULE DDR 128MB 200-SODIMM
Manufacturer
Micron Technology Inc
Specifications of MT4VDDT1664HY-335F3
Memory Type
DDR SDRAM
Memory Size
128MB
Speed
200MHz
Package / Case
200-SODIMM
Main Category
DRAM Module
Sub-category
DDR SDRAM
Module Type
200SODIMM
Device Core Size
64b
Organization
16Mx64
Total Density
128MByte
Chip Density
256Mb
Access Time (max)
700ps
Maximum Clock Rate
333MHz
Operating Supply Voltage (typ)
2.5V
Operating Current
880mA
Number Of Elements
4
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.3V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
200
Mounting
Socket
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
557-1344
Table 6:
NOTE:
Table 7:
pdf: 09005aef8086ea3d, source: 09005aef8086ea0b
DD4C8_16_32x64HG.fm - Rev. C 9/04 EN
LENGTH
1. For a burst length of two, A1
2. For a burst length of four, A2
3. For a burst length of eight, A3
4. Whenever a boundary of the block is reached within a
5. i = 8 (64MB, 128MB)
BURST
element block; A0 selects the first access within the
block.
element block; A0
block.
element block; A0
block.
given sequence above, the following access wraps
within the block.
i = 9 (256MB)
2
4
8
SPEED
-26A
-335
-262
-265
A2 A1 A0
0
0
0
0
1
1
1
1
STARTING
ADDRESS
COLUMN
Burst Definition Table
CAS Latency (CL) Table
A1 A0
0
0
1
1
0
0
1
1
0
0
1
1
A0
–
–
75
75
75
75
0
1
0
1
0
1
0
1
0
1
0
1
0
1
A1 select the first access within the
A2 select the first access within the
CLOCK FREQUENCY (MHZ)
CL = 2
ALLOWABLE OPERATING
0-1-2-3-4-5-6-7 0-1-2-3-4-5-6-7
1-2-3-4-5-6-7-0 1-0-3-2-5-4-7-6
2-3-4-5-6-7-0-1 2-3-0-1-6-7-4-5
3-4-5-6-7-0-1-2 3-2-1-0-7-6-5-4
4-5-6-7-0-1-2-3 4-5-6-7-0-1-2-3
5-6-7-0-1-2-3-4 5-4-7-6-1-0-3-2
6-7-0-1-2-3-4-5 6-7-4-5-2-3-0-1
7-0-1-2-3-4-5-6 7-6-5-4-3-2-1-0
f
f
f
f
SEQUENTIAL
133
133
133
100
TYPE =
0-1-2-3
1-2-3-0
2-3-0-1
3-0-1-2
ORDER OF ACCESSES
0-1
1-0
–
–
WITHIN A BURST
–
Ai select the two-data-
Ai select the four-data-
Ai select the eight-data-
75
75
75
75
INTERLEAVED
CL = 2.5
TYPE =
0-1-2-3
1-0-3-2
2-3-0-1
3-2-1-0
f
f
f 133
f 133
0-1
1-0
167
133
10
Operating Mode
MODE REGISTER SET command with bits A7–A11
(64MB), or A7–A12 (128MB, 256MB) each set to zero,
and bits A0–A6 set to the desired values. A DLL reset is
initiated by issuing a MODE REGISTER SET command
with bits A7 and A9–A11 (64MB), or A7 and A9–A12
(128MB, 256MB) each set to zero, bit A8 set to one, and
bits A0–A6 set to the desired values. Although not
required by the Micron device, JEDEC specifications
recommend when a LOAD MODE REGISTER com-
mand is issued to reset the DLL, it should always be
followed by a LOAD MODE REGISTER command to
select normal operating mode.
or A7–A12 (128MB, 256MB), are reserved for future use
and/or test modes. Test modes and reserved states
should not be used because unknown operation or
incompatibility with future versions may result.
Extended Mode Register
beyond those controlled by the mode register; these
additional functions are DLL enable/disable and out-
put drive strength. These functions are controlled via
the bits shown in Figure 5, Mode Register Definition
Diagram, on page 9. The extended mode register is
programmed via the LOAD MODE REGISTER com-
COMMAND
COMMAND
64MB, 128MB, 256MB (x64, SR)
The normal operating mode is selected by issuing a
All other combinations of values for A7–A11 (64MB),
The extended mode register controls functions
200-PIN DDR SDRAM SODIMM
DQS
DQS
CK#
CK#
DQ
DQ
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Figure 6: CAS Latency Diagram
CK
CK
READ
READ
Burst Length = 4 in the cases shown
Shown with nominal t AC, t DQSCK, and t DQSQ
T0
T0
TRANSITIONING DATA
CL = 2
CL = 2.5
NOP
NOP
T1
T1
©2004 Micron Technology, Inc. All rights reserved.
T2
NOP
NOP
T2
T2n
T2n
DON’T CARE
T3
NOP
NOP
T3
T3n
T3n