MT36LSDT25672G-13EC2 Micron Technology Inc, MT36LSDT25672G-13EC2 Datasheet - Page 21

• Manufacturer Part Number: MT36LSDT25672G-13EC2
• Description: MODULE SDRAM 2GB 168DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT36LSDT25672G-13EC2

• Memory Type: SDRAM
• Memory Size: 2GB
• Speed: 133MHz
• Package / Case: 168-DIMM
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Timing Requirements and Switching Characteristics
Table 15:
Table 16:
PDF: 09005aef80b1835d/Source: 09005aef80b18348
SD36C128_256x72G.fm - Rev. E 6/05 EN
Register
Parameter
Operating clock frequency
Input duty cycle
Cycle to cycle jitter
Static phase offset
SSC induced skew
Output to output skew
bit pattern by
JESD82-2
SSTL
Register Timing Requirements and Switching Characteristics
PLL Clock Driver Timing Requirements And Switching Characteristics
Symbol
f
t
t
clock
t
t
pd1
pd2
t
su
w
h
Notes: 1. SSC = Spread Spectrum Clock. the use of SSC synthesizers on the system motherboard will
Propagation delay, single rank
2. Skew is defined as the total clock skew between any two outputs and is therefore speci-
propagation delay, dual rank
reduce EMI.
fied as a maximum only.
Clock frequency
(CK to Output)
(CK to output)
Pulse duration
Parameter
Setup time
Symbol
Hold time
t
t
t
f
t
JIT
SSC
SK
t
CK
DC
∅
CC
O
Timing Requirements and Switching Characteristics
1GB, 2GB: (x72, ECC, DR) 168-Pin SDRAM RDIMM
Min
-150
-75
50
44
–
–
21
V
DD
0°C ≤ T
Data before CK HIGH
Data after CK HIGH
CK, HIGH or LOW
50pF to GND and
30pF to GND and
= +3.3V ±0.3V
50 Ohms to Vtt
Condition
50Ω to V
A
Micron Technology, Inc., reserves the right to change products or specifications without notice.
≤ 55°C
Max
TT
140
150
150
150
55
75
V
DD
0°C ≤ T
Min
150
1.4
0.7
3.3
.75
.75
= +3.3V ±0.3V
©2002 Micron Technology, Inc. All rights reserved.
Units
MHz
%
ps
ps
ps
ps
A
≤ 55°C
Max
240
3.5
2.4
–
–
–
Notes
1, 2
Units
MHz
ns
ns
ns
ns
ns