MT16LSDF6464HY-133D2 Micron Technology Inc, MT16LSDF6464HY-133D2 Datasheet - Page 21

MODULE SDRAM 512MB 144-SODIMM

MT16LSDF6464HY-133D2

Manufacturer Part Number
MT16LSDF6464HY-133D2
Description
MODULE SDRAM 512MB 144-SODIMM
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT16LSDF6464HY-133D2

Memory Type
SDRAM
Memory Size
512MB
Speed
133MHz
Package / Case
144-SODIMM
Main Category
DRAM Module
Sub-category
SDRAM
Module Type
144SODIMM
Device Core Size
64b
Organization
64Mx64
Total Density
512MByte
Chip Density
256Mb
Access Time (max)
6/5.4ns
Maximum Clock Rate
133MHz
Operating Supply Voltage (typ)
3.3V
Operating Current
1.096A
Number Of Elements
16
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Operating Temp Range
0C to 65C
Operating Temperature Classification
Commercial
Pin Count
144
Mounting
Socket
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT16LSDF6464HY-133D2
Manufacturer:
MICRON
Quantity:
1 575
Part Number:
MT16LSDF6464HY-133D2 PCB
Manufacturer:
SIEMENS
Quantity:
201
Table 20: Serial Presence-Detect Matrix (Continued)
“1”/“0”: Serial Data, “driven to HIGH”/“driven to LOW”; V
NOTE:
pdf: 09005aef807924d2, source: 09005aef807924f1
SDF16C32_64x64HG.fm - Rev. E 4/06 EN
1. The value of
99–125 Manufacturer-specific data (RSVD)
36–40 Reserved
42–61 Reserved
65–71 Manufacturer’s JEDEC ID code (continued)
73–90 Module part number (ASCII)
BYTE
95-98
126
127
31
32
33
34
35
41
62
63
64
72
91
92
93
94
Module rank density
Command and address setup time,
Command and address hold time,
Data signal input setup time,
Data signal input hold time,
Device MIN ACTIVE/AUTO-REFRESH time,
SPD revision
Checksum for bytes 0-62
Manufacturer’s JEDEC ID code
Manufacturing location
PCB identification code
Identification code (continued)
Year of manufacture in BCD
Week of manufacture in BCD
Module serial number
System frequency
SDRAM component and clock detail
t
RAS used for the -13E module is calculated from
DESCRIPTION
t
DH
t
DS
t
AH,
t
AS,
t
t
CMH
CMS
t
RC
ENTRY (VERSION)
DD
100 MHz/133 MHz
128MB or 256MB
1.5ns (-13E/-133)
0.8ns (-13E/-133)
1.5ns (-13E/-133)
0.8ns (-13E/-133)
(-13E/-133/-10E)
21
= +3.3V ±0.3V
66ns (-13E)
71ns (-133)
66ns (-10E)
2ns (-10E)
1ns (-10E)
2ns (-10E)
1ns (-10E)
MICRON
REV. 2.0
(-13E)
(-133)
(-10E)
1–12
t
1–9
RC -
0
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
RP. Actual device spec value is 37ns.
144-PIN SDRAM SODIMM
256MB, 512MB (x64, DR)
MT16LSDF3264H
Variable Data
Variable Data
Variable Data
Variable Data
01–0C
01–09
2D
20
15
20
08
10
15
20
08
10
00
3C
42
46
00
02
95
E1
2C
00
64
CF
FF
©2006 Micron Technology, Inc. All rights reserved.
MT16LSDF6464H
Variable Data
Variable Data
Variable Data
Variable Data
01– 0C
01–09
40
15
20
08
10
15
20
08
10
00
3C
42
46
00
02
B8
04
50
2C
00
64
CF
FF

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