HCPL-M454#500 Avago Technologies US Inc., HCPL-M454#500 Datasheet - Page 3

• Manufacturer Part Number: HCPL-M454#500
• Description: OPTOCOUPLER 1MBS TTL/IPM SO-5
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-M454#500

• Input Type: DC
• Package / Case: 5-SOP
• Number Of Channels: 1
• Voltage - Isolation: 3750Vrms
• Current Transfer Ratio (min): 25% @ 16mA
• Current Transfer Ratio (max): 60% @ 16mA
• Voltage - Output: 20V
• Current - Output / Channel: 8mA
• Current - Dc Forward (if): 25mA
• Output Type: Transistor with Vcc
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Output Device: Phototransistor
• Configuration: 1 Channel
• Current Transfer Ratio: 65 %
• Maximum Baud Rate: 1 MBps
• Maximum Forward Diode Voltage: 1.7 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Input Diode Current: 25 mA
• Maximum Power Dissipation: 100 mW
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Vce Saturation (max): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Absolute Maximum Ratings
(No Derating Required up to 85°C)
Storage Temperature .............................................................................-55°C to +125°C
Operating Temperature ........................................................................-55°C to +100°C
Average Input Current - I
Peak Input Current - I
Peak Transient Input Current - I
Reverse Input Voltage - V
Input Power Dissipation ......................................................................................45 mW
Average Output Current - I
Peak Output Current .................................................................................................16 mA
Output Voltage - V
Supply Voltage - V
Output Power Dissipation ............................................................................... 100 mW
Infrared and Vapor Phase Reflow Temperature ....................................... see below
TEMPERATURE
Solder Reflow Thermal Profile
ROOM
300
200
100
0
0
Note: Non-halide flux should be used.
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
CC
O
(Pin 5-4) .....................................................................-0.5 V to 20 V
(Pin 6-4) ....................................................................-0.5 V to 30 V
F
........................................................................................50 mA
F
R
50
(Pin 3-1) .............................................................................5 V
O
.................................................................................25 mA
3°C + 1°C/–0.5°C
(Pin 5) ....................................................................... 8 mA
PREHEATING TIME
150°C, 90 + 30 SEC.
F
............................................................................1.0 A
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
(50% duty cycle, 1 ms pulse width)
TEMP.
245°C
PEAK
(≤1 µs pulse width, 300 pps)
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
[1]
[2]
[3]
[4]
250