5962-8957101PC Avago Technologies US Inc., 5962-8957101PC Datasheet - Page 5
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5962-8957101PC
Manufacturer Part Number
5962-8957101PC
Description
OPTOCOUPLER GATE HERM SEAL 8DIP
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-5400.pdf
(12 pages)
Specifications of 5962-8957101PC
Package / Case
8-DIP (0.300", 7.62mm)
Voltage - Isolation
1500VDC
Number Of Channels
2, Unidirectional
Current - Output / Channel
25mA
Data Rate
20MBd
Propagation Delay High - Low @ If
33ns
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Through Hole
Maximum Continuous Output Current
25 mA
Maximum Fall Time
10 ns
Maximum Forward Diode Current
10 mA
Maximum Rise Time
15 ns
Minimum Forward Diode Voltage
1 V
Output Device
Logic Gate Photo IC
Configuration
2 Channel
Maximum Baud Rate
40 MBps
Maximum Forward Diode Voltage
1.85 V
Maximum Reverse Diode Voltage
3 V
Maximum Power Dissipation
200 mW
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Number Of Elements
2
Baud Rate
40Mbps
Forward Voltage
1.85V
Forward Current
10mA
Output Current
25mA
Package Type
PDIP
Operating Temp Range
-55C to 125C
Power Dissipation
200mW
Propagation Delay Time
60ns
Pin Count
8
Mounting
Through Hole
Reverse Breakdown Voltage
3V
Operating Temperature Classification
Military
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
5962-8957101PC
Manufacturer:
AVAGO
Quantity:
1 400
8 Pin Ceramic DIP Single Channel Schematic
Note enable pin 7. An external 0.01 F to 0.1 F bypass capacitor must be connected
between V
ESD Classification
(MIL-STD-883, Method 3015)
HCPL-5400/01/0K
HCPL-5430/31/3K and HCPL-6430/31/3K
Recommended Operating Conditions
Single Channel Product Only
Absolute Maximum Ratings
No derating required up to +125 C.
Parameter
Storage Temperature
Operating Temperature
Case Temperature
Junction Temperature
Lead Solder Temperature
Average Forward Current (each channel)
Peak Input Current (each channel)
Reverse Input Voltage (each channel)
Supply Voltage
Average Output Current (each channel)
Output Voltage (each channel)
Output Power Dissipation (each channel)
Package Power Dissipation (each channel)
Single Channel Product Only
Three State Enable Voltage
V
5
CATHODE
Parameter
Input Current (High)
Supply Voltage, Output
Input Voltage (Low)
Fan Out (Each Channel)
High Level Enable Voltage
Low Level Enable Voltage
F
ANODE
2
+
3
–
CC
I
F
and ground for each package type.
Symbol
I
V
V
N
V
V
F(ON)
CC
F(OFF)
EH
EL
I
I
CC
E
Min.
6
4.75
–
–
2.0
0
8
7
6
5
V
V
V
GND
CC
E
O
Symbol
T
T
T
T
I
I
V
V
I
V
P
P
V
F(AVG)
F(PEAK)
O(AVG)
S
A
C
J
R
CC
O
O
D
E
(
(Dot), Class 3
Max.
10
5.25
0.7
5
V
0.8
CC
), Class 2
Units
mA
V
V
TTL Loads
V
V
Min.
-65
-55
0.0
-25
-0.5
-0.5
Max.
+150
+125
+170
+175
260 for 10 sec
10
20
3
7.0
25
10
130
200
10
Units
mA
mA
V
V
mA
V
mW
mW
V
C
C
C
C
C
Note
1