5962-8957101PC Avago Technologies US Inc., 5962-8957101PC Datasheet - Page 2

• Manufacturer Part Number: 5962-8957101PC
• Description: OPTOCOUPLER GATE HERM SEAL 8DIP
• Manufacturer: Avago Technologies US Inc.

Specifications of 5962-8957101PC

• Package / Case: 8-DIP (0.300", 7.62mm)
• Voltage - Isolation: 1500VDC
• Number Of Channels: 2, Unidirectional
• Current - Output / Channel: 25mA
• Data Rate: 20MBd
• Propagation Delay High - Low @ If: 33ns
• Current - Dc Forward (if): 10mA
• Input Type: DC
• Output Type: Push-Pull, Totem-Pole
• Mounting Type: Through Hole
• Maximum Continuous Output Current: 25 mA
• Maximum Fall Time: 10 ns
• Maximum Forward Diode Current: 10 mA
• Maximum Rise Time: 15 ns
• Minimum Forward Diode Voltage: 1 V
• Output Device: Logic Gate Photo IC
• Configuration: 2 Channel
• Maximum Baud Rate: 40 MBps
• Maximum Forward Diode Voltage: 1.85 V
• Maximum Reverse Diode Voltage: 3 V
• Maximum Power Dissipation: 200 mW
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Number Of Elements: 2
• Baud Rate: 40Mbps
• Forward Voltage: 1.85V
• Forward Current: 10mA
• Output Current: 25mA
• Package Type: PDIP
• Operating Temp Range: -55C to 125C
• Power Dissipation: 200mW
• Propagation Delay Time: 60ns
• Pin Count: 8
• Mounting: Through Hole
• Reverse Breakdown Voltage: 3V
• Operating Temperature Classification: Military
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Each channel contains an AlGaAs light emitting diode
which is optically coupled to an integrated high gain
photon detector. This combination results in very high
data rate capability. The detector has a threshold with
hysteresis, which typically provides 0.25 mA of differen-
tial mode noise immunity and minimizes the potential
for output signal chatter. The detector in the single
channel units has a three state output stage which
eliminates the need for a pull-up resistor and allows for
direct drive of a data bus.
All units are compatible with TTL, STTL, LSTTL, and
HCMOS logic families. The 35 ns pulse width distortion
specification guarantees a 10 MBd signaling rate at
+125 C with 35% pulse width distortion. Figures 13
through 16 show recommended circuits for reducing
pulse width distortion and optimizing the signal rate of
the product. Package styles for these parts are 8 pin
Selection Guide–Package Styles and Lead Configuration Options
*Solder contains lead.
2
Package
Lead Style
Channels
Common Channel Wiring
Avago Part # & Options
Commercial
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
Solder Dipped*
Butt Cut/Gold Plate
Gull Wing/Soldered*
Class H SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped*
Butt Cut/Gold Plate
Butt Cut/Soldered*
Gull Wing/Soldered*
Class K SMD Part #
Prescript for all below
Either Gold of Solder
Gold Plate
Solder Dipped*
Butt Cut/Gold Plate
Butt Cut/Soldered*
Gull Wing/Soldered*
8 Pin DIP
Through Hole
1
None
HCPL-5400
HCPL-5401
HCPL-540K
Gold Plate
Option 200
Option 100
Option 300
5962-
8957001PX
8957001PC
8957001PA
8957001YC
8957001YA
8957001XA
5962-
8957002KPX
8957002KPC
8957002KPA
8957002KYC
8957002KYA
8957002KXA
DIP through hole (case outlines P), and leadless ceramic
chip carrier (case outline 2). Devices may be purchased
with a variety of lead bend and plating options. See
Selection Guide Table for details. Standard Microcircuit
Drawing (SMD) parts are available for each package and
lead style.
Because the same electrical die (emitters and detectors)
are used for each channel of each device listed in this
data sheet, absolute maximum ratings, recommended
operating conditions, electrical specifications, and
performance characteristics shown in the figures are
similar for all parts. Occasional exceptions exist due to
package variations and limitations and are as noted.
Additionally, the same package assembly processes and
materials are used in all devices. These similarities give
justification for the use of data obtained from one part
to represent other part’s performance for die related
reliability and certain limited radiation test results.
8 Pin DIP
Through Hole
2
V
HCPL-5430
HCPL-5431
HCPL-543K
Gold Plate
Option 200
Option 100
Option 300
5962-
8957101PX
8957101PC
8957101PA
8957101YC
8957101YA
8957101XA
5962-
8957103KPX
8957103KPC
8957103KPA
8957103KYC
8957103KYA
8957103KXA
CC
, GND
20 Pad LCCC
Surface Mount
2
None
HCPL-6430
HCPL-6431
HCPL-643K
Solder Pads*
5962-
89571022X
89571022A
5962-
8957104K2X
8957104K2A