5962-8957101PC Avago Technologies US Inc., 5962-8957101PC Datasheet - Page 3

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5962-8957101PC

Manufacturer Part Number
5962-8957101PC
Description
OPTOCOUPLER GATE HERM SEAL 8DIP
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of 5962-8957101PC

Package / Case
8-DIP (0.300", 7.62mm)
Voltage - Isolation
1500VDC
Number Of Channels
2, Unidirectional
Current - Output / Channel
25mA
Data Rate
20MBd
Propagation Delay High - Low @ If
33ns
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Through Hole
Maximum Continuous Output Current
25 mA
Maximum Fall Time
10 ns
Maximum Forward Diode Current
10 mA
Maximum Rise Time
15 ns
Minimum Forward Diode Voltage
1 V
Output Device
Logic Gate Photo IC
Configuration
2 Channel
Maximum Baud Rate
40 MBps
Maximum Forward Diode Voltage
1.85 V
Maximum Reverse Diode Voltage
3 V
Maximum Power Dissipation
200 mW
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Number Of Elements
2
Baud Rate
40Mbps
Forward Voltage
1.85V
Forward Current
10mA
Output Current
25mA
Package Type
PDIP
Operating Temp Range
-55C to 125C
Power Dissipation
200mW
Propagation Delay Time
60ns
Pin Count
8
Mounting
Through Hole
Reverse Breakdown Voltage
3V
Operating Temperature Classification
Military
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
5962-8957101PC
Manufacturer:
AVAGO
Quantity:
1 400
Part Number:
5962-8957101PC
Manufacturer:
AVAGO
Quantity:
154
;; ; ; ;; ; ;
8.70 (0.342)
9.10 (0.358)
0.51 (0.020)
Functional Diagrams
Note: All DIP devices have common V
ground connections.
Outline Drawings
20 Terminal LCCC Surface Mount, 2 Channels
8 Pin DIP Through Hole, 1 and 2 Channel
3
2.29 (0.090)
2.79 (0.110)
MIN.
1.78 (0.070)
2.03 (0.080)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.52 (0.060)
2.03 (0.080)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
1
2
3
4
8 Pin DIP
Through Hole
1 Channel
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.76 (0.030)
1.27 (0.050)
9.40 (0.370)
9.91 (0.390)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
0.64
(0.025)
(20 PLCS)
GND
V
CC
V
V
E
O
0.51 (0.020)
8
7
6
5
3.81 (0.150)
MAX.
CC
1.02 (0.040) (3 PLCS)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALLIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MIN.
and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate V
MAX.
1
2
3
4
8 Pin DIP
Through Hole
2 Channels
8.13 (0.320)
7.16 (0.282)
7.57 (0.298)
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
MAX.
GND
V
V
V
CC
O1
O2
8
7
6
5
19
20
20 Pad LCCC
Surface Mount
2 Channels
2
3
GND
V
1
CC2
15
V
V
7
O2
O1
GND
8
V
CC1
2
13
12
10
CC
and

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