HCPL-4661 Avago Technologies US Inc., HCPL-4661 Datasheet - Page 7
![OPTOCPLR 2CH LOG-OUT 10MBD 8-DIP](/photos/7/66/76618/516-8-dip_sml.jpg)
HCPL-4661
Manufacturer Part Number
HCPL-4661
Description
OPTOCPLR 2CH LOG-OUT 10MBD 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-0600-500E.pdf
(22 pages)
Specifications of HCPL-4661
Voltage - Isolation
5000Vrms
Number Of Channels
2, Unidirectional
Current - Output / Channel
50mA
Data Rate
10MBd
Propagation Delay High - Low @ If
50ns @ 7.5mA
Current - Dc Forward (if)
20mA
Input Type
DC
Output Type
Open Collector
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
No. Of Channels
2
Isolation Voltage
3.75kV
Optocoupler Output Type
Logic Gate
Input Current
15mA
Output Voltage
7V
Opto Case Style
DIP
No. Of Pins
8
Propagation Delay Low-high
100ns
Common Mode Voltage Vcm
1000V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
516-1092-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-4661
Manufacturer:
AVAGO
Quantity:
40 000
Part Number:
HCPL-4661
Manufacturer:
AGILENT
Quantity:
20 000
Company:
Part Number:
HCPL-4661#300E
Manufacturer:
AVAGO
Quantity:
6 000
Company:
Part Number:
HCPL-4661#500
Manufacturer:
AVAGO
Quantity:
8 000
Company:
Part Number:
HCPL-4661#500E
Manufacturer:
AVAGO
Quantity:
6 000
Company:
Part Number:
HCPL-4661-000E
Manufacturer:
AVAGO
Quantity:
40 000
Part Number:
HCPL-4661-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Part Number:
HCPL-4661-300E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Part Number:
HCPL-4661-320E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Part Number:
HCPL-4661-500E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Solder Reflow Temperature Profile
7
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300
(HCNW137, HCNW2601/11)
TEMPERATURE
ROOM
(0.071 ± 0.006)
1.80 ± 0.15
300
200
100
0
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
1
8
(0.442 ± 0.006)
11.23 ± 0.15
7
2
(0.100)
3
6
BSC
2.54
50
3 °C + 1 °C/–0.5 °C
4
5
(0.061)
MAX.
1.55
150 °C, 90 + 30 SEC.
PREHEATING TIME
(0.354 ± 0.006)
(0.158)
9.00 ± 0.15
4.00
MAX.
(0.030 ± 0.010)
2.5 C ± 0.5 °C/SEC.
0.75 ± 0.25
100
TIME (SECONDS)
LAND PATTERN RECOMMENDATION
245 °C
TEMP.
PEAK
(0.051)
1.3
(0.039 ± 0.006)
(0.484 ± 0.012)
1.00 ± 0.15
12.30 ± 0.30
(0.433)
150
11.00
MAX.
SEC.
30
SEC.
30
(0.09)
2.29
50 SEC.
7° NOM.
SOLDERING
200 °C
TIME
200
(0.534)
13.56
(0.010
0.254
PEAK
TEMP.
240 °C
- 0.0051
+ 0.003)
- 0.002)
+ 0.076
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250