L6712D STMicroelectronics, L6712D Datasheet - Page 7

• Manufacturer Part Number: L6712D
• Description: IC CTRLR DC/DC 2PHASE 28-SOIC
• Manufacturer: STMicroelectronics
• Type: Step-Down (Buck)r

Specifications of L6712D

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 2
• Voltage - Output: 0.9 ~ 3.3 V
• Current - Output: 2A
• Frequency - Switching: 150kHz
• Voltage - Input: 12V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (7.5mm Width)
• Power - Output: 2W
• Operating Temperature Range: - 40 C to + 125 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-5364-5; L6712D

Table 6. Pin Function (continued)
(*) Pin not reported in QFN column have to be considered as Not Connected, not internally bonded.
Figure 4. Reference Schematic
GNDin
20 to 22
Vin
SO
23
24
25
26
27
28
N. (*)
S2
S1
S0
VFQFPN
22 to 24
PAD
31,
25
27
28
29
30
32
L1
THERMAL
PHASE2
HS1
LS1
UGATE2
PGOOD
LGATE2
BOOT2
VID0-2
PGND
Name
PAD
REF_IN/OUT
Rg
Rg
OSC / INH
LGATE1
VCCDR
PGNDS1
UGATE1
PHASE1
BOOT1
ISEN1
SGND
VID0
VID2
VID1
Voltage IDentification pins. These input are internally pulled-up. They are used to
program the output voltage as specified in Table 1 and to set the PGOOD, OVP
and UVP thresholds.
Connect to GND to program a ‘0’ while leave floating to program a ‘1’.
This pin is an open collector output and is pulled low if the output voltage is not
within the above specified thresholds and during soft-start.
It cannot be pulled up above 5V. If not used may be left floating.
Channel 2 HS driver supply. This pin supplies the relative high side driver.
Connect through a capacitor (100nF typ.) to the PHASE2 pin and through a diode
to VCC (cathode vs. boot).
Channel 2 HS driver output.
A little series resistor helps in reducing device-dissipated power.
Channel 2 HS driver return path. It must be connected to the HS2 mosfet source
and provides the return path for the HS driver of channel 2.
Channel 2 LS driver output.
A little series resistor helps in reducing device-dissipated power.
LS drivers return path.
This pin is common to both sections and it must be connected through the
closest path to the LS mosfets source pins in order to reduce the noise injection
into the device.
Thermal pad connects the silicon substrate and makes a good thermal contact
with the PCB to dissipate the power necessary to drive the external
mosfets.Connect to the GND plane with several vias to improve thermal
conductivity.
FBR
L6712A
L6712
FBG
VCC
BOOT2
UGATE2
PHASE2
LGATE2
ISEN2
PGNDS2
PGND
PGOOD
COMP
DROOP
FB
VSEN
Rg
Rg
C
R
R
F
F
FB
Description
HS2
LS2
L2
C
C
IN
OUT
L6712A L6712
PGOOD
LOAD
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