LTC3731HG Linear Technology, LTC3731HG Datasheet - Page 32

• Manufacturer Part Number: LTC3731HG
• Description: IC REG SW SYNC 3PH STPDWN 36SSOP
• Manufacturer: Linear Technology
• Series: PolyPhase®r
• Type: Step-Down (Buck)r

Specifications of LTC3731HG

• Internal Switch(s): No
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.6 ~ 6 V
• Frequency - Switching: 225kHz ~ 680kHz
• Voltage - Input: 4 ~ 36 V
• Operating Temperature: -40°C ~ 140°C
• Mounting Type: Surface Mount
• Package / Case: 36-SSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Output: -
• Power - Output: -
• Lead Free Status / Rohs Status: Not Compliant

LTC3731H
package DescripTion
5.50 0.05

4.10 0.05
(4 SIDES)
3.50 REF
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD LAYOUT
PIN 1
TOP MARK
(NOTE 6)
3.45 0.05
5.00 0.10
(4 SIDES)
3.45 0.05
0.50 BSC
0.25 0.05
(Reference LTC DWG # 05-08-1693 Rev D)
32-Lead Plastic QFN (5mm × 5mm)
0.70 0.05
PACKAGE OUTLINE
UH Package
0.75 0.05
(4-SIDES)
3.50 REF
0.00 – 0.05
0.200 REF
R = 0.05
TYP
BOTTOM VIEW—EXPOSED PAD
R = 0.115
3.45 0.10
TYP
3.45 0.10
31
0.50 BSC
0.25 0.05
32
PIN 1 NOTCH R = 0.30 TYP
OR 0.35 45° CHAMFER
(UH32) QFN 0406 REV D
1
2
0.40 0.10
3731Hfb