LTC3734EUH#TRPBF Linear Technology, LTC3734EUH#TRPBF Datasheet - Page 27

• Manufacturer Part Number: LTC3734EUH#TRPBF
• Description: IC CTRLR DC/DC 1PH HI EFF 32QFN
• Manufacturer: Linear Technology

Specifications of LTC3734EUH#TRPBF

• Applications: Controller, Intel Mobile CPU
• Voltage - Input: 4 ~ 30 V
• Number Of Outputs: 1
• Voltage - Output: 0.7 ~ 1.71 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGE DESCRIPTIO
5.50 ±0.05
4.10 ±0.05
3.45 ±0.05
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
RECOMMENDED SOLDER PAD LAYOUT
PIN 1
TOP MARK
(NOTE 6)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5.00 ± 0.10
(4 SIDES)
U
0.50 BSC
32-Lead Plastic QFN (5mm × 5mm)
0.25 ± 0.05
(Reference LTC DWG # 05-08-1693)
0.70 ±0.05
UH Package
PACKAGE OUTLINE
0.75 ± 0.05
3.45 ± 0.10
(4-SIDES)
0.00 – 0.05
0.200 REF
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
31
0.50 BSC
0.25 ± 0.05
32
LTC3734
(4 SIDES)
0.23 TYP
1
2
(UH) QFN 0603
0.40 ± 0.10
27
3734f