ISL6306IRZ Intersil, ISL6306IRZ Datasheet - Page 32

IC CTRLR PWM 4-PHASE 40-QFN

ISL6306IRZ

Manufacturer Part Number
ISL6306IRZ
Description
IC CTRLR PWM 4-PHASE 40-QFN
Manufacturer
Intersil
Datasheet

Specifications of ISL6306IRZ

Pwm Type
Voltage Mode
Number Of Outputs
1
Frequency - Max
275kHz
Duty Cycle
66.7%
Voltage - Supply
4.75 V ~ 5.25 V
Buck
Yes
Boost
No
Flyback
No
Inverting
No
Doubler
No
Divider
No
Cuk
No
Isolated
No
Operating Temperature
-40°C ~ 85°C
Package / Case
40-VFQFN, 40-VFQFPN
Frequency-max
275kHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ISL6306IRZ
Manufacturer:
Intersil
Quantity:
330
ISL6306
and output signals. If possible, duplicate the same
placement of these components for each phase.
Next, place the input and output capacitors. Position one
high-frequency ceramic input capacitor next to each upper
MOSFET drain. Place the bulk input capacitors as close to
the upper MOSFET drains as dictated by the component
size and dimensions. Long distances between input
capacitors and MOSFET drains result in too much trace
inductance and a reduction in capacitor performance. Locate
the output capacitors between the inductors and the load,
while keeping them in close proximity to the microprocessor
socket.
The ISL6306 can be placed off to one side or centered
relative to the individual phase switching components.
Routing of sense lines and PWM signals will guide final
placement. Critical small signal components to place close
to the controller include the ISEN resistors, R
resistor,
T
feedback resistor, and compensation components.
Bypass capacitors for the ISL6306 and ISL66XX driver bias
supplies must be placed next to their respective pins. Trace
parasitic impedances will reduce their effectiveness.
Plane Allocation and Routing
Dedicate one solid layer, usually a middle layer, for a ground
plane. Make all critical component ground connections with
vias to this plane. Dedicate one additional layer for power
planes; breaking the plane up into smaller islands of
common voltage. Use the remaining layers for signal wiring.
Route phase planes of copper filled polygons on the top and
bottom once the switching component placement is set. Size
the trace width between the driver gate pins and the
MOSFET gates to carry 4A of current. When routing
components in the switching path, use short wide traces to
reduce the associated parasitic impedances.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
32
FN9226.1
May 5, 2008

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