SE97PW,118 NXP Semiconductors, SE97PW,118 Datasheet - Page 53

IC TEMP SENSOR DIMM 8-TSSOP

SE97PW,118

Manufacturer Part Number
SE97PW,118
Description
IC TEMP SENSOR DIMM 8-TSSOP
Manufacturer
NXP Semiconductors
Datasheet

Specifications of SE97PW,118

Function
Temp Monitoring System (Sensor)
Topology
ADC (Sigma Delta), Comparator, Register Bank
Sensor Type
Internal
Sensing Temperature
-40°C ~ 125°C
Output Type
I²C™/SMBus™
Output Alarm
Yes
Output Fan
Yes
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP
Temperature Threshold
+ 165 C
Full Temp Accuracy
1 %
Digital Output - Bus Interface
I2C, SMBus
Digital Output - Number Of Bits
11 bit
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Description/function
Memory Module Temperature Sensor
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Supply Current
250 uA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4291-2
935284062118
SE97PW-T
NXP Semiconductors
15. Revision history
Table 34.
SE97_7
Product data sheet
Document ID
SE97_7
Modifications:
SE97_6
SE97_5
SE97_4
SE97_3
SE97_2
SE97_1
Revision history
Release date
20100129
20090817
20090806
20090130
20080715
20071012
20070524
Table 1 “Ordering
– added Type number SE97TP/S900
– added
Added (new)
Section 7.7 “SMBus
35 ms” to “between 25 ms and 35 ms”
Table 8 “Register
– Default state is split: A200h for SE97PW, SE97TK; A201h for SE97TP, SE97TL
Section 8.8 “Device ID
– 1
Added (new)
Table 33.
Acronym
RDIMM
SMBus
SO-DIMM
SPD
is A2h.”
Table note [1]
st
paragraph, 1
Table note [3]
Abbreviations
Figure 6 “Pin configuration for HWSON8 (SOT1069-2)”
Figure 45 “Package outline SOT1069-2 (HWSON8)”
Data sheet status
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Objective data sheet
modified
summary”, address 07h (Device ID/Revision register):
information”:
st
Description
Registered Dual In-line Memory Module
System Management Bus
Small Outline Dual In-line Memory Module
Serial Presence Detect
time-out”, 1st paragraph, second sentence: changed from “between 25 ns and
sentence: changed from “The SE97 device ID is A1h.” to “The SE97 device ID
register”:
Rev. 07 — 29 January 2010
DDR memory module temp sensor with integrated SPD, 3.3 V
…continued
Change notice
-
-
-
-
-
-
-
Supersedes
SE97_6
SE97_5
SE97_4
SE97_3
SE97_2
SE97_1
-
© NXP B.V. 2010. All rights reserved.
SE97
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