IR3527MTRPBF International Rectifier, IR3527MTRPBF Datasheet - Page 19

• Manufacturer Part Number: IR3527MTRPBF
• Description: IC CTRL XPHASE3 DUAL 24-MLPQ
• Manufacturer: International Rectifier
• Series: XPhase3™r

Specifications of IR3527MTRPBF

• Applications: Processor
• Current - Supply: 8mA
• Voltage - Supply: 8 V ~ 28 V
• Operating Temperature: 0°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: *
• Package: 24-Lead MLPQ
• Circuit: X-Phase Phase IC
• Iout (a): 1.3A Gate Driver
• Pbf: PbF Option Available
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Stencil Design
x The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands.
x The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead
x The land pad aperture should be 4 square openings of 1.1 mm sides and spaced at 0.2 mm to deposit
x The maximum length and width of the land pad stencil aperture should be equal to the solder resist
Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm
pitch devices the leads are only 0.25mm wide, the stencil apertures should not be made narrower;
openings in stencils < 0.25mm wide are difficult to maintain repeatable solder release.
land.
approximately 76% area of solder on the center pad. If too much solder is deposited on the center pad the
part will float and the lead lands will be open.
opening minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the
lead lands when the part is pushed into the solder paste.
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