IR3529MTRPBF International Rectifier, IR3529MTRPBF Datasheet - Page 21

• Manufacturer Part Number: IR3529MTRPBF
• Description: IC CTRL XPHASE CPU/ASIC 20-MLPQ
• Manufacturer: International Rectifier
• Series: XPhase3™r

Specifications of IR3529MTRPBF

• Applications: Processor
• Current - Supply: 2mA
• Voltage - Supply: 8 V ~ 16 V
• Operating Temperature: 0°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: *
• Package: 20-Lead MLPQ
• Circuit: X-Phase Phase IC
• Iout (a): 4.0A Gate Driver
• Pbf: PbF Option Available
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: IR3529MTRPBFTR

Stencil Design
• The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands.
• The stencil lead land apertures should therefore be shortened in length by 80% and centered on the lead
• The land pad aperture should be striped with 0.25mm wide openings and spaces to deposit approximately
• The maximum length and width of the land pad stencil aperture should be equal to the solder resist opening
Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm
pitch devices the leads are only 0.25mm wide, the stencil apertures should not be made narrower; openings
in stencils < 0.25mm wide are difficult to maintain repeatable solder release.
land.
50% area of solder on the center pad. If too much solder is deposited on the center pad the part will float
and the lead lands will be open.
minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the lead lands
when the part is pushed into the solder paste.
Page 21 of 22
February 12, 2010
IR3529