IR3529MTRPBF International Rectifier, IR3529MTRPBF Datasheet - Page 18

• Manufacturer Part Number: IR3529MTRPBF
• Description: IC CTRL XPHASE CPU/ASIC 20-MLPQ
• Manufacturer: International Rectifier
• Series: XPhase3™r

Specifications of IR3529MTRPBF

• Applications: Processor
• Current - Supply: 2mA
• Voltage - Supply: 8 V ~ 16 V
• Operating Temperature: 0°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: *
• Package: 20-Lead MLPQ
• Circuit: X-Phase Phase IC
• Iout (a): 4.0A Gate Driver
• Pbf: PbF Option Available
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: IR3529MTRPBFTR

LAYOUT GUIDELINES
The following layout guidelines are recommended to reduce the parasitic inductance and resistance of the PCB
layout; therefore, minimizing the noise coupled to the IC.
• Dedicate at least one middle layer for a ground plane, which is then split into signal ground plane (LGND) and
• Separate analog bus (EAIN, DACIN, and IOUT) from digital bus (CLKIN, PSI, PHSIN, and PHSOUT) to
• Connect PGND to LGND pins of each phase IC to the ground tab, which is tied to LGND and PGND planes
• Place current sense resistors and capacitors (R
• Place the decoupling capacitors C
• Place the phase IC as close as possible to the MOSFETs to reduce the parasitic resistance and inductance of
• Place the input ceramic capacitors close to the drain of top MOSFET and the source of bottom MOSFET. Use
• There are two switching power loops. One loop includes the input capacitors, top MOSFET, inductor, output
power ground plane (PGND).
reduce the noise coupling.
respectively through vias.
inductor current sense wires, but separate the two wires by ground polygon. The wire from the inductor
terminal to CSIN- should not cross over the fast transition nodes, i.e., switching nodes, gate drive outputs,
and bootstrap nodes.
IC respectively.
the gate drive paths.
combination of different packages of ceramic capacitors.
capacitors and the load; another loop consists of bottom MOSFET, inductor, output capacitors and the load.
Route the switching power paths using wide and short traces or polygons; use multiple vias for connections
between layers.
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VCC
and C
VCCL
CS
and C
as close as possible to VCC and VCCL pins of the phase
CS
) close to phase IC. Use Kelvin connection for the
February 12, 2010
IR3529