LTC3577EUFF#PBF Linear Technology, LTC3577EUFF#PBF Datasheet - Page 52

• Manufacturer Part Number: LTC3577EUFF#PBF
• Description: IC PWR MANAGEMENT HANDHELD 44QFN
• Manufacturer: Linear Technology

Specifications of LTC3577EUFF#PBF

• Applications: Handheld/Mobile Devices
• Voltage - Supply: 4.35 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 44-QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -

LTC3577/LTC3577-1
PACKAGE DESCRIPTION
52
7.00 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
(SEE NOTE 6)
TOP MARK
PIN 1
4.50 ±0.05
3.10 ±0.05
4.00 0.10
2.40 REF
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.64 ±0.05
(Reference LTC DWG # 05-08-1762 Rev Ø)
44-Lead Plastic QFN (4mm × 7mm)
RECOMMENDED SOLDER PAD LAYOUT
2.56 ±0.05
0.200 REF
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
Variation: UFFMA
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
0.20 ±0.05
UFF Package
6.10 ±0.05
7.50 ±0.05
0.75 0.05
5.60 REF
1.70 ±0.05
2.02 ±0.05
2.76 ±0.05
0.00 – 0.05
1.48 ±0.05
5.60 REF
0.40 BSC
R = 0.10 TYP
0.98 ±0.10
BOTTOM VIEW—EXPOSED PAD
±0.10
±0.10
2.56
1.70
0.70 ±0.05
0.98 ±0.05
±0.10
PACKAGE
OUTLINE
2.64
2.40 REF
±0.10
2.76
R = 0.10
TYP
43
44
0.40 BSC
0.20 0.05
(UFF44MA) QFN REF Ø 1107
1
2
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 45
CHAMFER
0.40 0.10
R = 0.10 TYP
0.74 ±0.10
0.74 ±0.10
3577fa