VNH2SP30-E STMicroelectronics, VNH2SP30-E Datasheet - Page 32

• Manufacturer Part Number: VNH2SP30-E
• Description: IC DRIVER MOTOR H BRIDGE
• Manufacturer: STMicroelectronics
• Type: Half Bridge Motor Driverr

Specifications of VNH2SP30-E

• Applications: Automotive
• Number Of Outputs: 1
• Current - Output: 30A
• Voltage - Supply: 5.5 V ~ 16 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 30-MPSO, MultiPowerSO
• Operating Supply Voltage: 5.5 V to 16 V
• Supply Current: 10 mA
• Mounting Style: SMD/SMT
• Device Type: Motor
• Module Configuration: Full Bridge
• Peak Output Current: 30A
• Output Resistance: 0.014ohm
• Input Delay: 250µs
• Output Delay: 250µs
• Supply Voltage Range: 5.5V To 36V
• Rohs Compliant: Yes
• No. Of Outputs: 2
• Output Current: 30A
• No. Of Pins: 30
• Operating Temperature Range: -40°C To +150°C
• Motor Type: Half Bridge
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Load: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-4500-5; VNH2SP30

Revision history
6
32/33
Revision history
Table 18.
01-Sep-2006
15-May-2007
06-Feb-2008
02-Oct-2008
Dec- 2004
Sep-2004
Feb-2005
Apr-2005
Date
Document revision history
Revision
1
2
3
4
5
6
7
8
First issue
Inserted t
Modified I
Minor changes
Public release
Document converted into new ST corporate template.
Added table of contents, list of tables and list of figures
Removed figure number from package outline
Changed
Added
Added
Added “low” and “high” to parameters for I
page 9
Inserted note in
Added vertical limitation line to left side arrow of t
page 13
Added
Added
Added
Updated disclaimer (last page) to include a mention about the use of
ST products in automotive applications
Document reformatted and converted into new ST template.
Corrected Heat Slug numbers in
functions.
Added new infomation in
Added
cleared)
Section 1: Block diagram and pin description on page 5
Section 2.2: Electrical characteristics on page 9
Section 4.1: PowerSSO-30 thermal data on page 25
Section 5: Package and packing information on page 29
Section 5.3: Packing information on page 31
Figure 33: Behavior in fault condition (How a fault can be
off(min)
RM
Features on page 1
figure number
test condition modification and note
Figure 32 on page 20
Description of changes
Table 6: Power section
to add ECOPACK
Table 3: Pin definitions and
INL
and I
on page 1
®
D(off)
package
INH
in
to
VNH2SP30-E
Table 7 on
Figure 7 on