VNH2SP30-E STMicroelectronics, VNH2SP30-E Datasheet - Page 26

• Manufacturer Part Number: VNH2SP30-E
• Description: IC DRIVER MOTOR H BRIDGE
• Manufacturer: STMicroelectronics
• Type: Half Bridge Motor Driverr

Specifications of VNH2SP30-E

• Applications: Automotive
• Number Of Outputs: 1
• Current - Output: 30A
• Voltage - Supply: 5.5 V ~ 16 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 30-MPSO, MultiPowerSO
• Operating Supply Voltage: 5.5 V to 16 V
• Supply Current: 10 mA
• Mounting Style: SMD/SMT
• Device Type: Motor
• Module Configuration: Full Bridge
• Peak Output Current: 30A
• Output Resistance: 0.014ohm
• Input Delay: 250µs
• Output Delay: 250µs
• Supply Voltage Range: 5.5V To 36V
• Rohs Compliant: Yes
• No. Of Outputs: 2
• Output Current: 30A
• No. Of Pins: 30
• Operating Temperature Range: -40°C To +150°C
• Motor Type: Half Bridge
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Load: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-4500-5; VNH2SP30

Package and PCB thermal data
4.1.1
4.1.2
4.1.3
4.1.4
a.
26/33
Calculation is valid in any dynamic operating condition. P
Thermal calculation in clockwise and anti-clockwise operation in
steady-state mode
Table 15.
Thermal resistances definition (values according to the PCB heatsink
area)
R
HS
R
R
between High Side and Low Side Chips
R
Chips
Thermal calculation in transient mode
T
T
T
Single pulse thermal impedance definition
(values according to the PCB heatsink area)
Z
Z
Z
between High Side and Low Side Chips
Z
Chips
OFF ON
HS
ON OFF OFF ON
jHSAB
jLSA
jLSB
thHS
thLS
thHSLS
thLSLS
thHS
thLS
thHSLS
thLSLS
B
A
in ON state)
= Z
= Z
= Z
HS
= R
= High Side Chip Thermal Impedance Junction to Ambient
= R
= Z
= Z
= R
= Z
= R
B
thLSA
thHSLS
thHSLS
thHSA
thLSA
thHS
thLSALSB
thHSABLSA
LS
thLSALSB
thHSALSB
ON OFF
Thermal calculation in clockwise and anti-clockwise operation in steady-
state mode
A
= Z
= R
x P
= R
x P
x P
LS
thLSB
dHSAB
thLSB
thHSB
dHSAB
dHSAB
B
= Mutual Thermal Impedance Junction to Ambient between Low Side
= Mutual Thermal Resistance Junction to Ambient between Low Side
= R
= Z
P
x R
P
x R
= Low Side Chip Thermal Impedance Junction to Ambient
dHSA
dHSB
= Low Side Chip Thermal Resistance Junction to Ambient
= High Side Chip Thermal Resistance Junction to Ambient (HS
thHSBLSA
+ Z
thHSABLSB
thHSLS
thHSLS
+ Z
+ Z
thHSLS
x R
x R
thLS
thLSLS
T
jHSAB
thHS
thHS
+ T
+ T
x P
= Mutual Thermal Resistance Junction to Ambient
amb
amb
x (P
= Mutual Thermal Impedance Junction to Ambient
+ P
+ P
x P
d
dLSA
values set by user.
dLSB
dLSA
dLSA
dLSA
+ Z
+ Z
+ P
P
P
P
P
thLSLS
dHSA
dLSB
dHSB
dLSA
thLS
dLSB
(a)
x R
x R
x R
x R
x P
x P
) + T
T
thLSLS
thLS
thHSLS
thHSLS
jLSA
dLSB
dLSB
amb
+ T
+ T
+ T
+ T
+
+
amb
amb
amb
amb
P
x R
P
x R
dHSA
dHSB
thLS
thLSLS
x R
x R
+ T
T
thHSLS
thHSLS
+ T
VNH2SP30-E
amb
jLSB
amb
+ P
+ P
dLSB
dLSA
A
or