BUK1M200-50SDLD,11 NXP Semiconductors, BUK1M200-50SDLD,11 Datasheet - Page 5
![TOPFET QUAD 50V 20-SOIC](/photos/6/52/65266/568-20-soic_sot163-1_sml.jpg)
BUK1M200-50SDLD,11
Manufacturer Part Number
BUK1M200-50SDLD,11
Description
TOPFET QUAD 50V 20-SOIC
Manufacturer
NXP Semiconductors
Series
TOPFET™r
Type
Low Sider
Datasheet
1.BUK1M200-50SDLD11.pdf
(14 pages)
Specifications of BUK1M200-50SDLD,11
Input Type
Non-Inverting
Number Of Outputs
4
On-state Resistance
150 mOhm
Current - Peak Output
1.3A
Mounting Type
Surface Mount
Package / Case
20-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Supply
-
Operating Temperature
-
Current - Output / Channel
-
Other names
934057352115
BUK1M200-50SDLDT/R
BUK1M200-50SDLDT/R
BUK1M200-50SDLDT/R
BUK1M200-50SDLDT/R
Philips Semiconductors
5. Thermal characteristics
Table 4:
9397 750 10956
Product data
Symbol
R
Fig 4. Normalized total power dissipation as a function of solder point temperature.
th(j-sp)
P
der
=
Parameter
thermal resistance from junction to
solder point.
Thermal characteristics
---------------------- -
P
tot 25 C
P
tot
100%
P der
(%)
120
80
40
0
0
Conditions
mounted on thermo clad board
one device active
all devices active
Rev. 01 — 02 April 2003
50
100
150
T sp ( C)
BUK1M200-50SDLD
03aa17
200
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Min
-
-
Quad channel TOPFET™
Typ
-
-
Max
45
13.3
Unit
K/W
K/W
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