BUK1M200-50SDLD,11 NXP Semiconductors, BUK1M200-50SDLD,11 Datasheet - Page 5

• Manufacturer Part Number: BUK1M200-50SDLD,11
• Description: TOPFET QUAD 50V 20-SOIC
• Manufacturer: NXP Semiconductors
• Series: TOPFET™r
• Type: Low Sider

Specifications of BUK1M200-50SDLD,11

• Input Type: Non-Inverting
• Number Of Outputs: 4
• On-state Resistance: 150 mOhm
• Current - Peak Output: 1.3A
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Current - Output / Channel: -
• Other names: 934057352115; BUK1M200-50SDLDT/R; BUK1M200-50SDLDT/R

Philips Semiconductors
5. Thermal characteristics
Table 4:
9397 750 10956
Product data
Symbol
R
Fig 4. Normalized total power dissipation as a function of solder point temperature.
th(j-sp)
P
der
=
Parameter
thermal resistance from junction to
solder point.
Thermal characteristics
---------------------- -
P
tot 25 C
P
tot
100%
P der
(%)
120
80
40
0
0
Conditions
mounted on thermo clad board
one device active
all devices active
Rev. 01 — 02 April 2003
50
100
150
T sp ( C)
BUK1M200-50SDLD
03aa17
200
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Min
-
-
Quad channel TOPFET™
Typ
-
-
Max
45
13.3
Unit
K/W
K/W
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