MCZ33937AEK Freescale Semiconductor, MCZ33937AEK Datasheet - Page 8

• Manufacturer Part Number: MCZ33937AEK
• Description: IC PRE-DRIVER 3PH ENH 54-SOIC
• Manufacturer: Freescale Semiconductor
• Series: SMARTMOS™r
• Type: 3 Phase Pre-Driverr

Specifications of MCZ33937AEK

• Configuration: 3 Phase Bridge
• Input Type: Non-Inverting
• Delay Time: 265ns
• Current - Peak: 600mA
• Number Of Configurations: 1
• Number Of Outputs: 3
• High Side Voltage - Max (bootstrap): 15V
• Voltage - Supply: 8 V ~ 40 V
• Operating Temperature: -40°C ~ 135°C
• Mounting Type: Surface Mount
• Package / Case: 54-SOIC (7.5mm Width) Exposed Pad, 54-eSOIC, 54-HSOIC
• Supply Current: 12 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 3. Maximum Ratings (continued)
damage to the device.
8
33937
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
THERMAL RATINGS
Notes
ESD Voltage
Storage Temperature
Operating Junction Temperature
Thermal Resistance
Soldering Temperature
All voltages are with respect to V
6.
7.
8.
9.
Human Body Model - HBM (All pins except for the pins listed below)
Pins: PA_Boot, PA_HS_S, PA_HS_G, PB_Boot, PB_HS_S, PB_HS_G,
PC_Boot, PC_HS_S, PC_HS_G, VPWR
Charge Device Model - CDM
Junction-to-Case
ESD testing is performed in accordance with the Human Body Model (HBM) (C
Model (CDM), Robotic (C
Case is considered EP - pin 55 under the body of the device. The actual power dissipation of the device is dependent on the operating
mode, the heat transfer characteristics of the board and layout and the operating voltage. See
power dissipation profiles of two common configurations. Operation above the maximum operating junction temperature will result in a
reduction in reliability leading to malfunction or permanent damage to the device.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
Corner pins
All other pins
(6)
(7)
(8)
ZAP
Ratings
= 4.0 pF).
SS
unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
T
Symbol
ZAP
SOLDER
V
T
R
STG
T
ESD
= 100 pF, R
J
JC
Analog Integrated Circuit Device Data
Figure 24
ZAP
= 1500 ) and the Charge Device
-55 to +150
-40 to +150
±2000
±1000
Value
Note 9
±750
±300
3.0
and
Freescale Semiconductor
Figure 25
for examples of
°C/W
Unit
°C
°C
°C
V