PCF8576T/1,112 NXP Semiconductors, PCF8576T/1,112 Datasheet - Page 35

• Manufacturer Part Number: PCF8576T/1,112
• Description: IC LCD DRV UNVRSL LOW-MUX 56VSOP
• Manufacturer: NXP Semiconductors

Specifications of PCF8576T/1,112

• Package / Case: 56-VSOP
• Mounting Type: Surface Mount
• Current - Supply: 180µA
• Voltage - Supply: 2 V ~ 9 V
• Operating Temperature: -40°C ~ 85°C
• Interface: I²C
• Display Type: LCD
• Configuration: 40 Segment
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Digits Or Characters: -
• Lead Free Status / Rohs Status: Details
• Other names: 933804620112::PCF8576T/1::PCF8576T/1

Philips Semiconductors
Table 15 Bonding pad locations (dimensions in m)
All x and y coordinates are referenced to centre of chip
(see Fig.30).
2001 Oct 02
SDA
SCL
SYNC
CLK
V
OSC
A0
A1
A2
SA0
V
V
BP0
BP2
BP1
BP3
S0
S1
S2
S3
S4
S5
S6
S7
S8
S9
S10
S11
S12
SYMBOL
DD
SS
LCD
Universal LCD driver for low multiplex rates
PAD
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
1
2
3
4
5
6
7
8
9
1105
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1105
245
445
645
865
865
645
445
245
155
45
45
155
355
x
COORDINATES
1100
1300
1500
1700
1900
1900
1900
1900
1900
1900
1900
1900
1900
1900
1900
1900
1900
1900
1900
1900
1900
1700
1500
1300
1100
300
500
700
900
y
35
Table 16 Bonding pad dimensions
S13
S14
S15
S16
S17
S18
S19
S20
S21
S22
S23
S24
S25
S26
S27
S28
S29
S30
S31
S32
S33
S34
S35
S36
S37
S38
S39
Pad pitch
Pad size, aluminium
Gold bump dimensions
SYMBOL
PAD
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
200 m
120
94
1155
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1375
1155
555
755
955
955
755
555
355
x
COORDINATES
94
120 m
Product specification
25 m
PCF8576
1900
1900
1900
1900
1900
1660
1420
1200
1000
1000
1200
1420
1660
1900
1900
1900
1900
1900
800
600
400
200
200
400
600
800
900
y