M29DW323DB90N6 STMicroelectronics, M29DW323DB90N6 Datasheet - Page 48
![IC FLASH 32MBIT 90NS 48TSOP](/photos/7/26/72669/497-48-tsop_series_sml.jpg)
M29DW323DB90N6
Manufacturer Part Number
M29DW323DB90N6
Description
IC FLASH 32MBIT 90NS 48TSOP
Manufacturer
STMicroelectronics
Datasheet
1.M29DW323DB70N6.pdf
(50 pages)
Specifications of M29DW323DB90N6
Format - Memory
FLASH
Memory Type
FLASH - Nor
Memory Size
32M (4Mx8, 2Mx16)
Speed
90ns
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
M29DW323DT, M29DW323DB
REVISION HISTORY
Table 33. Document Revision History
48/50
07-May-2003
20-Sep-2001
18-Sep-2003
07-Nov-2003
26-Oct-2001
16-Jan-2002
19-Apr-2002
24-Apr-2002
08-Apr-2003
25-Jun-2003
07-Oct-2003
19-Jul-2002
Date
Version
-01
-02
-03
-04
-05
-06
6.1
6.2
7.0
7.1
7.2
7.3
First Issue (Target Specification)
Document expanded to full Product Preview
Corrections made in “Primary Algorithm-Specific Extended Query” Table in Appendix-B
Description of Ready/Busy signal clarified (and
Clarified allowable commands during block erase
Clarified the mode the device returns to in the CFI Read Query command section
tPLYH (time to reset device) re-specified.
Values for addresses 23h and 25h corrected in CFI Query System Interface Information
table in Appendix B
When in Extended Block mode, the block at the boot block address can be used as OTP.
Data Toggle Flow chart corrected. Document promoted from “Product Preview” to
“Preliminary Data”.
Revision numbering modified: a minor revision will be indicated by incrementing the digit
after the dot, and a major revision, by incrementing the digit before the dot (revision
version 06 equals 6.0).
Revision History moved to end of document.
TFBGA48, 6 x 8mm, 0.80mm pitch package added. Identification Current I
Table 14., DC
parameters and notes added to
Endurance
APPENDIX C., EXTENDED MEMORY
read the Extended Memory Block. Extended Memory Block Verify Code row added to
Tables
Address modified in
Status Register
22., Ordering Information
Data, and
Package
Document promoted from Preliminary Data to full Datasheet status. Packing option added
to
Status of Ready/Busy signal for Erase Suspend Operation modified in
Register
Figures
Table 18., Toggle and Alternative Toggle Bits AC
Note 1 of
Figures
and 2 added.
Table 18., Toggle and Alternative Toggle Bits AC Characteristics
Figure 8.
Status of Ready/Busy signal for Program Error, Chip Erase and Block Erase modified in
Table 8., Status Register
Table 20., TSOP48 Lead Plastic Thin Small Outline, 12x20 mm, Package Mechanical
Table 22., Ordering Information
3
14
14
and 4,
Bits.
Outline, corrected.
renamed and flowchart modified; Note added.
Table 28., Device Geometry
Figure 18., TSOP48 Lead Plastic Thin Small Outline, 12x20 mm, Bottom View
and 15, Toggle and Alternative Toggle Bits Mechanisms added.
and 15, Toggle and Alternative Toggle Bits Mechanisms modified and Notes 1
Cycles.
Characteristics. Erase Suspend Latency time and Data Retention
Bus Operations, BYTE = V
Bits. V
Auto Select
SS
Bits.
pin connection to ground clarified. Note added to
Scheme.
Table 7., Program, Erase Times and Program, Erase
Command. Chip Erase Address modified in
Scheme.
Revision Details
Definition, modified
BLOCK, added.
IL
and
Figure 16.
Bus Operations, BYTE = V
Characteristics, added.
Auto Select Command
modified)
modified.
Table 8., Status
ID
Table
removed from
IH
Table
. Bank
sued to
8.,