CY7C1471V33-117AXC Cypress Semiconductor Corp, CY7C1471V33-117AXC Datasheet - Page 29

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CY7C1471V33-117AXC

Manufacturer Part Number
CY7C1471V33-117AXC
Description
IC SRAM 72MBIT 117MHZ 100LQFP
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1471V33-117AXC

Format - Memory
RAM
Memory Type
SRAM - Synchronous
Memory Size
72M (2M x 36)
Speed
117MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
100-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1471V33-117AXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Document #: 38-05288 Rev. *I
Document History Page
Document Title: CY7C1471V33/CY7C1473V33/CY7C1475V33, 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM
with NoBL™ Architecture
Document #: 38-05288
REV.
*A
*B
*C
*D
*E
*G
*H
*F
**
*I
ECN NO. Issue Date
121521
223721
235012
243572
320197
331513
416221
472335
114675
299511
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
08/06/02
02/07/03
Change
Orig. of
RYQ
RXU
PKS
CJM
VKN
NJY
NJY
SYT
PCI
PCI
New Data Sheet
Updated features for package offering
Updated ordering information
Changed Advanced Information to Preliminary
Changed timing diagrams
Changed logic block diagrams
Modified Functional Description
Modified “Functional Overview” section
Added boundary scan order for all packages
Included thermal numbers and capacitance values for all packages
Removed 150-MHz speed grade offering
Included ISB and IDD values
Changed package outline for 165FBGA package and 209-ball BGA package
Removed 119-BGA package offering
Minor Change: The data sheets do not match on the spec system and
external web
Changed ball H2 from V
Modified capacitance values on page 21
Removed 117-MHz Speed Bin
Changed Θ
TQFP Package on Page # 21
Added lead-free information for 100-Pin TQFP, 165 FBGA and 209 BGA
Packages
Added comment of ‘Lead-free BG packages availability’ below the Ordering
Information
Corrected part number typos in the logic block diagram on page# 2
Address expansion pins/balls in the pinouts for all packages are modified as
per JEDEC standard
Added Address Expansion pins in the Pin Definitions Table
Added Industrial Operating Range
Modified V
Updated Ordering Information Table
Converted from Preliminary to Final
Changed address of Cypress Semiconductor Corporation on Page# 1 from
“3901 North First Street” to “198 Champion Court”
Removed 100MHz Speed bin & Added 117MHz Speed bin
Changed the description of I
Current on page# 19
Changed the I
to –30 µA and 5 µA
Changed the I
to –5 µA and 30 µA
Changed V
Replaced Package Name column with Package Diagram in the Ordering
Information table
Updated the Ordering Information Table
Corrected the typo in the pin configuration for 209-Ball FBGA pinout
(Corrected the ball name for H9 to V
Added the Maximum Rating for Supply Voltage on V
Changed t
AC Switching Characteristics table.
Updated the Ordering Information table.
TH
OL
JA
IH
, t
, V
from 16.8 to 24.63 °C/W and Θ
< V
X
X
TL
current values of MODE on page # 19 from –5 µA and 30 µA
OH
current values of ZZ on page # 19 from –30 µA and 5 µA
DD
from 25 ns to 20 ns and t
Test Conditions
to V
DD
IH
Description of Change
< V
to NC in the 165-ball FBGA package in page 6
X
from Input Load Current to Input Leakage
DD
on page # 19
SS
from V
TDOV
JC
SSQ
from 3.3 to 2.28 °C/W for 100
from 5 ns to 10 ns in TAP
).
CY7C1471V33
CY7C1473V33
CY7C1475V33
DDQ
Relative to GND.
Page 29 of 29

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