MT41J256M8JE-187E:A Micron Technology Inc, MT41J256M8JE-187E:A Datasheet - Page 86
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MT41J256M8JE-187E:A
Manufacturer Part Number
MT41J256M8JE-187E:A
Description
IC DDR3 SDRAM 2GBIT 82FBGA
Manufacturer
Micron Technology Inc
Type
DDR3 SDRAMr
Specifications of MT41J256M8JE-187E:A
Format - Memory
RAM
Memory Type
DDR3 SDRAM
Memory Size
2G (256M x 8)
Speed
533MHz
Interface
Parallel
Voltage - Supply
1.425 V ~ 1.575 V
Operating Temperature
0°C ~ 95°C
Package / Case
82-FBGA
Organization
256Mx8
Address Bus
18b
Maximum Clock Rate
1.066GHz
Operating Supply Voltage (typ)
1.5V
Package Type
FBGA
Operating Temp Range
0C to 95C
Operating Supply Voltage (max)
1.575V
Operating Supply Voltage (min)
1.425V
Supply Current
295mA
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
Q4329252
Available stocks
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Manufacturer
Quantity
Price
Company:
Part Number:
MT41J256M8JE-187E:A
Manufacturer:
MICRON
Quantity:
985
Company:
Part Number:
MT41J256M8JE-187E:A
Manufacturer:
Micron Technology Inc
Quantity:
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2Gb_DDR3_SDRAM.pdf – Rev. K 04/10 EN
37. Although CKE is allowed to be registered LOW after a REFRESH command when
38. ODT turn-on time MIN is when the device leaves High-Z and ODT resistance begins to
39. Half-clock output parameters must be derated by the actual
40. ODT turn-off time minimum is when the device starts to turn off ODT resistance. ODT turn-
41. Pulse width of a input signal is defined as the width between the first crossing of
42. Should the clock rate be larger than
FPDEN (MIN) is satisfied, there are cases where additional time such as
required.
turn on. ODT turn-on time maximum is when the ODT resistance is fully on. The ODT
reference load is shown in Figure 22 (page 57).
input clock jitter is present. This results in each parameter becoming larger. The parame-
ters
t
required to be derated by subtracting both
off time maximum is when the DRAM buffer is in High-Z. The ODT reference load is
shown in Figure 23 (page 60). This output load is used for ODT timings (see Figure 30
(page 71)).
V
have at least one NOP command between it and another AUTO REFRESH command. Ad-
ditionally, if the clock rate is slower than 40ns (25 MHz), all REFRESH commands should
be followed by a PRECHARGE ALL command.
ERR
REF(DC)
t
10
ADC (MIN) and
PER (MAX) and
and the consecutive crossing of V
t
AOF (MIN) are each required to be derated by subtracting both
t
JITdty (MAX). The parameters
86
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
RFC (MIN), an AUTO REFRESH command should
REF(DC)
t
2Gb: x4, x8, x16 DDR3 SDRAM
ERR
.
10
PER (MAX) and
t
ADC (MAX) and
t
© 2006 Micron Technology, Inc. All rights reserved.
ERR
10
t
JITdty (MAX).
PER and
t
AOF (MAX) are
t
XPDLL (MIN) is
t
JITdty when
t
RE-
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