CY62177EV30LL-55ZXI Cypress Semiconductor Corp, CY62177EV30LL-55ZXI Datasheet - Page 2

IC SRAM 32MBIT 55NS LP 48-TSOP

CY62177EV30LL-55ZXI

Manufacturer Part Number
CY62177EV30LL-55ZXI
Description
IC SRAM 32MBIT 55NS LP 48-TSOP
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY62177EV30LL-55ZXI

Memory Size
32M (4Mx8, 2Mx16)
Package / Case
48-TSOP I
Format - Memory
RAM
Memory Type
SRAM
Speed
55ns
Interface
Parallel
Voltage - Supply
2.2 V ~ 3.7 V
Operating Temperature
-40°C ~ 85°C
Access Time
55 ns
Supply Voltage (max)
3.7 V
Supply Voltage (min)
2.2 V
Maximum Operating Current
45 mA
Organization
2 M x 16, 4 M x 8
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Operating Supply Voltage
3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY62177EV30LL-55ZXI
Manufacturer:
XILINX
Quantity:
1 000
Part Number:
CY62177EV30LL-55ZXI
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Part Number:
CY62177EV30LL-55ZXI
0
Pin Configuration
Product Portfolio
Notes
Document #: 001-09880 Rev. *D
CY62177EV30LL
2. Ball E3 for the FBGA package is used to upgrade to a 64M density.
3. NC pins are not connected on the die.
4. DNU Pin# 13 needs to be left floating to ensure proper application.
5. The BYTE pin in the 48-TSOPI package has to be tied to V
6. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
tying the BYTE signal to V
Product
BLE
IO
V
IO
V
IO
IO
A
SS
CC
1
18
14
15
8
9
Figure 1. 48-Ball VFBGA
BHE
IO
IO
IO
OE
IO
A
A
2
19
8
10
11
12
13
NC
A
A
A
A
A
A
A
3
17
14
12
SS
9
0
3
5
Min
2.2
. In the 4M x 8 configuration, Pin 45 is A21, while BHE, BLE, and IO
A
A
A
A
A
A
A
A
4
15
13
10
1
4
6
7
16
V
CC
CE
IO
IO
IO
WE
A
A
IO
5
Range (V)
Typ
11
2
1
3
4
5
3.0
1
[6]
Vcc
Vss
CE
[2, 3]
IO
IO
A
IO
IO
6
20
0
2
2
6
7
Max
CC
D
G
B
C
E
F
H
A
3.7
to use the device as a 2M x 16 SRAM. The 48-TSOPI package can also be used as a 4M x 8 SRAM by
Speed
DNU
BHE
(ns)
CE2
A15
A14
A13
A12
A10
A19
A20
BLE
A18
A17
A11
WE
55
A9
A8
A7
A6
A5
A4
A3
A2
A1
Figure 2. 48-Pin TSOPI (Forward) (2M x 16 / 4M x 8)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Typ
4.5
f = 1 MHz
[6]
Operating I
8
to IO
Max
5.5
14
pins are not used.
Power Dissipation
CC
Typ
CC
35
(mA)
CY62177EV30 MoBL
[6]
= V
f = f
CC(typ)
Max
Max
, T
45
A
= 25°C.
Standby I
Typ
3
[6]
Page 2 of 13
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
[3, 4, 5]
SB2
A16
BYTE
Vss
IO15/A21
IO7
IO14
IO6
IO13
IO5
IO12
IO4
Vcc
IO11
IO3
IO10
IO2
IO9
IO1
IO8
IO0
OE
Vss
CE1
A0
Max
25
(μA)
®
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