IS42S32400E-6BL ISSI, Integrated Silicon Solution Inc, IS42S32400E-6BL Datasheet - Page 59

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IS42S32400E-6BL

Manufacturer Part Number
IS42S32400E-6BL
Description
IC SDRAM 128MBIT 166MHZ 90FBGA
Manufacturer
ISSI, Integrated Silicon Solution Inc
Type
SDRAMr
Datasheets

Specifications of IS42S32400E-6BL

Format - Memory
RAM
Memory Type
SDRAM
Memory Size
128M (4Mx32)
Speed
166MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Package / Case
90-FBGA
Organization
4Mx32
Density
128Mb
Address Bus
14b
Access Time (max)
6.5/5.4ns
Maximum Clock Rate
166MHz
Operating Supply Voltage (typ)
3.3V
Package Type
TFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
180mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IS42S32400E-6BL
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Quantity:
10 000
Part Number:
IS42S32400E-6BL-TR
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Quantity:
10 000
IS42S32400E
Plastic TSOP 54–Pin, 86-Pin
Package Code: T (Type II)
Integrated Silicon Solution, Inc. - www.issi.com
Rev. 00C
08/01/08
N
1
ZD
No. Leads (N)
Ref. Std.
Symbol
ZD
A1
A2
E1
L1
C
D
A
b
E
e
L
e
Plastic TSOP (T - Type II)
Min
22.02 22.42
10.03 10.29
11.56 11.96
Millimeters
0.71 REF
0.05
0.30
0.12
0.80 BSC
0.40
Max
1.20
0.15
0.45
0.21
0.60
54
D
Min
0.002 0.006
0.012 0.018
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.031 BSC
0.016 0.024
Inches
Max
0.047
N/2+1
b
N/2
E1
A
A1
No. Leads (N)
Ref. Std.
Symbol
E
A1
A2
E1
L1
ZD
A
C
D
E
b
e
L
SEATING PLANE
Plastic TSOP (T - Type II)
Min
Millimeters
22.02 22.42
10.03 10.29
11.56 11.96
0.05
0.95
0.17
0.12
0.40
0.80 REF
0.61 REF
0.50 BSC
Notes:
1. Controlling dimension: millimieters,
2. BSC = Basic lead spacing between
3. Dimensions D and E1 do not include
4. Formed leads shall be planar with
unless otherwise specified.
centers.
mold flash protrusions and
measured from the bottom of the
package
respect to one another within 0.004
inches at the seating plane.
L
Max
1.20
0.15
1.05
0.27
0.21
0.60
.
86
Min
0.002 0.006
0.037 0.041
0.007 0.011
0.005 0.008
0.867 0.8827
0.395 0.405
0.455 0.471
0.020 BSC
0.016 0.024
0.031 REF
Inches
0.024 BSC
Max
0.047
should be
C
59

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