BCX56 /T3 NXP Semiconductors, BCX56 /T3 Datasheet
BCX56 /T3
Specifications of BCX56 /T3
Related parts for BCX56 /T3
BCX56 /T3 Summary of contents
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... BCP56; BCX56; BC56PA NPN medium power transistors Rev. 9 — 25 October 2011 1. Product profile 1.1 General description NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BCP56 BCX56 BC56PA [1] Valid for all available selection groups. 1.2 Features and benefits ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin SOT223 SOT89 SOT1061 Ordering information Table 4. Type number BCP56 BCX56 BC56PA [1] Valid for all available selection groups. BCP56_BCX56_BC56PA Product data sheet BCP56; BCX56; BC56PA Pinning Description base collector emitter collector ...
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... NXP Semiconductors 4. Marking Table 5. Type number BCP56 BCP56-10 BCP56-16 BCX56 BCX56-10 BCX56-16 BC56PA BC56-10PA BC56-16PA BCP56_BCX56_BC56PA Product data sheet BCP56; BCX56; BC56PA Marking codes All information provided in this document is subject to legal disclaimers. Rev. 9 — 25 October 2011 NPN medium power transistors ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors 1.5 (1) P tot (W) (2) 1.0 (3) 0.5 0.0 –75 –25 25 (1) FR4 PCB, mounting pad for collector 6 cm (2) FR4 PCB, mounting pad for collector 1 cm (3) FR4 PCB, standard footprint Fig 1. Power derating curves SOT223 (1) FR4 PCB, 4-layer copper, mounting pad for collector 1 cm (2) FR4 PCB, single-sided copper, mounting pad for collector 6 cm ...
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... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 1 0. 0.5 0.33 0.2 0.1 10 0.05 0.02 0. –1 10 –5 – FR4 PCB, standard footprint Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0.1 10 0.05 0. 0.01 –1 10 –5 – FR4 PCB, mounting pad for collector 1 cm Fig 5 ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0.1 10 0.05 0. 0.01 –1 10 –5 – FR4 PCB, mounting pad for collector 6 cm Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values th(j-a) duty cycle = 1 (K/W) 0.75 0 0.33 0.2 0.1 0.05 10 0.02 0. –1 10 – ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 0. –1 10 –5 – FR4 PCB, mounting pad for collector 1 cm Fig 8. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values th(j-a) (K/W) 2 duty cycle = 1 10 0.75 0.5 0.33 0.2 0.1 10 0.05 0. 0.01 –1 10 – ...
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... NXP Semiconductors th(j-a) duty cycle = 1 (K/W) 0.75 0 0.33 0.25 0.2 0.1 0.05 10 0.02 0. –1 10 –5 – FR4 PCB, single-sided copper, standard footprint Fig 10. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.25 0.2 0.1 10 0.05 0.02 0. –1 10 –5 – ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.25 0.2 0.1 10 0.05 0. 0.01 –1 10 –5 – FR4 PCB, single-sided copper, mounting pad for collector 6 cm Fig 12. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.25 0.2 0.1 10 ...
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... NXP Semiconductors th(j-a) (K/ duty cycle = 1 0.75 0.5 0.33 0.25 0.2 10 0.1 0.05 0.02 1 0.01 0 –1 10 –5 – FR4 PCB, 4-layer copper, mounting pad for collector 1 cm Fig 14. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values 7. Characteristics Table amb Symbol ...
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... NXP Semiconductors 300 h FE (1) 200 (2) 100 (3) 0 –4 –3 – 100 C (1) T amb = 25 C (2) T amb = 55 C (3) T amb Fig 15. DC current gain as a function of collector current; typical values 1 (V) (1) 0.8 (2) (3) 0.4 0.0 – ...
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... NXP Semiconductors 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline Fig 19. Package outline SOT223 (SC-73) Fig 20. Package outline SOT89 (SC-62/TO-243) ...
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... NXP Semiconductors Fig 21. Package outline SOT1061 (HUSON3) 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BCP56 BCX56 BC56PA [1] For further information and the availability of packing methods, see [2] Valid for all available selection groups. ...
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... NXP Semiconductors 11. Soldering 1.3 (4×) (4×) Fig 22. Reflow soldering footprint SOT223 (SC-73) 1.9 Fig 23. Wave soldering footprint SOT223 (SC-73) BCP56_BCX56_BC56PA Product data sheet 7 3.85 3.6 3.5 0.3 1 2.3 2.3 1.2 (3×) 1.3 (3×) 6.15 8.9 6 2.7 2.7 1.9 1.1 (2×) All information provided in this document is subject to legal disclaimers. Rev. 9 — 25 October 2011 BCP56; BCX56; BC56PA NPN medium power transistors 3 ...
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... NXP Semiconductors 0.85 4.6 Fig 24. Reflow soldering footprint SOT89 (SC-62/TO-243) 7.6 Fig 25. Wave soldering footprint SOT89 (SC-62/TO-243) BCP56_BCX56_BC56PA Product data sheet BCP56; BCX56; BC56PA 4.75 2.25 2 1.9 1.2 0.2 1.2 1 (3×) 1.5 1.5 3.95 6.6 2.4 3.5 0.5 1.8 (2×) 1.9 1.9 1.5 0.7 (2×) 5.3 All information provided in this document is subject to legal disclaimers. Rev. 9 — 25 October 2011 NPN medium power transistors 1 ...
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... NXP Semiconductors Fig 26. Reflow soldering footprint SOT1061 (HUSON3) BCP56_BCX56_BC56PA Product data sheet BCP56; BCX56; BC56PA 1.05 0.6 0.55 2.3 solder paste = solder lands solder resist Reflow soldering is the only recommended soldering method. All information provided in this document is subject to legal disclaimers. Rev. 9 — 25 October 2011 NPN medium power transistors 2 ...
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... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date BCP56_BCX56_BC56PA v.9 20111025 Modifications: BC639_BCP56_BCX56 v.8 20070622 BC639_BCP56_BCX56 v.7 20050308 BC639_BCP56_BCX56 v.6 20050303 BC635_637_639 v.4 20011010 BCP54_55_56 v.5 20030206 BCX54_55_56 v.4 20011010 BCP56_BCX56_BC56PA Product data sheet BCP56; BCX56; BC56PA Data sheet status Product data sheet • Type number removed: BC639 • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 6 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . 14 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . 14 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 10 Packing information . . . . . . . . . . . . . . . . . . . . 15 11 Soldering ...