BCX56-10,115 NXP Semiconductors, BCX56-10,115 Datasheet
BCX56-10,115
Specifications of BCX56-10,115
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BCX56-10 T/R
BCX56-10 T/R
BCX56-10,115
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BCX56-10,115 Summary of contents
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... BC639; BCP56; BCX56 NPN medium power transistors Rev. 08 — 22 June 2007 1. Product profile 1.1 General description NPN medium power transistor series. Table 1. Type number [2] BC639 BCP56 BCX56 [1] Valid for all available selection groups. [2] Also available in SOT54A and SOT54 variant packages (see 1 ...
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... BC639_BCP56_BCX56_8 Product data sheet Pinning Description base collector emitter base collector emitter base collector emitter base collector emitter collector emitter collector base Rev. 08 — 22 June 2007 BC639; BCP56; BCX56 NPN medium power transistors Simplified outline Symbol 001aab347 001aab348 001aab447 ...
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... SC-73 plastic surface-mounted package with increased heatsink; 4 leads SC-62 plastic surface-mounted package; collector pad for good heat transfer; 3 leads Marking codes Rev. 08 — 22 June 2007 BC639; BCP56; BCX56 NPN medium power transistors Section 2 and Section Marking code C639 C63910 C63916 ...
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... T BC639 BCP56 BCX56 junction temperature ambient temperature storage temperature Rev. 08 — 22 June 2007 BC639; BCP56; BCX56 NPN medium power transistors Min - - - - - amb [1] - [1] ...
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... FR4 PCB, mounting pad for collector 1 cm (2) FR4 PCB, standard footprint Fig 2. Power derating curves SOT223 1.6 P tot (W) (1) 1.2 (2) 0.8 (3) 0 Rev. 08 — 22 June 2007 BC639; BCP56; BCX56 NPN medium power transistors 1.6 tot 1.2 (1) 0.8 (2) 0 006aaa087 125 175 amb 006aaa086 ...
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... Product data sheet Thermal characteristics Parameter Conditions thermal resistance from in free air junction to ambient BC639 BCP56 BCX56 thermal resistance from junction to solder point BC639 BCP56 BCX56 Rev. 08 — 22 June 2007 BC639; BCP56; BCX56 NPN medium power transistors Min Typ [ [ [ [ [ [ ...
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... FR4 PCB, mounting pad for collector 1 cm Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values BC639_BCP56_BCX56_8 Product data sheet Rev. 08 — 22 June 2007 BC639; BCP56; BCX56 NPN medium power transistors © NXP B.V. 2007. All rights reserved. 006aaa814 (s) p 006aaa089 3 ...
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... FR4 PCB, mounting pad for collector 1 cm Fig 8. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values BC639_BCP56_BCX56_8 Product data sheet Rev. 08 — 22 June 2007 BC639; BCP56; BCX56 NPN medium power transistors © NXP B.V. 2007. All rights reserved. 006aaa815 (s) p 006aaa090 3 ...
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... DC current gain 150 500 current gain selection - 150 selection - 150 collector-emitter I = 500 mA saturation voltage base-emitter voltage collector capacitance MHz transition frequency 100 MHz 300 s; = 0.02. p Rev. 08 — 22 June 2007 BC639; BCP56; BCX56 NPN medium power transistors Min Typ = [ 100 - [ [1] = 500 mA; 100 180 C © ...
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... I (mA) C Fig 11. Collector current as a function of 006aaa081 V CEsat ( (mA) C (1) T (2) T (3) T Fig 13. Collector-emitter saturation voltage as a Rev. 08 — 22 June 2007 BC639; BCP56; BCX56 NPN medium power transistors 1.6 I (mA 1.2 0.8 0 0.4 0.8 1 amb collector-emitter voltage; typical values 1 1 (1) ...
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... Dimensions in mm Fig 16. Package outline SOT54 variant Fig 18. Package outline SOT89 (SC-62/TO-243) BC639_BCP56_BCX56_8 Product data sheet BC639; BCP56; BCX56 4.2 0.45 3.6 0.38 0.48 0.40 1 4.8 2 4.4 2.54 1.27 3 04-11-16 Dimensions in mm Fig 15 ...
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... pitch tape and reel; T3 Section Rev. 08 — 22 June 2007 BC639; BCP56; BCX56 NPN medium power transistors [1] Packing quantity 1000 4000 - - ...
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... Figure 9: added Figure 11: amended Table 9 “Packing methods”: new packing method for BCX56 added Section 11 “Legal information”: updated Product data sheet Product data sheet Product specification Product specification Product specification Rev. 08 — 22 June 2007 BC639 ...
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... For additional information, please visit: For sales office addresses, send an email to: BC639_BCP56_BCX56_8 Product data sheet BC639; BCP56; BCX56 [3] Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Document identifier: BC639_BCP56_BCX56_8 All rights reserved. Date of release: 22 June 2007 ...