BCP52 /T3 NXP Semiconductors, BCP52 /T3 Datasheet
BCP52 /T3
Specifications of BCP52 /T3
Related parts for BCP52 /T3
BCP52 /T3 Summary of contents
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... BCP52; BCX52; BC52PA PNP medium power transistors Rev. 9 — 18 October 2011 1. Product profile 1.1 General description PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BCP52 BCX52 BC52PA [1] Valid for all available selection groups. 1.2 Features and benefits ...
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... NXP Semiconductors Table 2. Symbol Pinning information Table 3. Pin SOT223 SOT89 SOT1061 BCP52_BCX52_BC52PA Product data sheet BCP52; BCX52; BC52PA Quick reference data …continued Parameter Conditions = current gain 150 selection - ...
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... NXP Semiconductors 3. Ordering information Table 4. Type number BCP52 BCX52 BC52PA [1] Valid for all available selection groups. 4. Marking Table 5. Type number BCP52 BCP52-10 BCP52-16 BCX52 BCX52-10 BCX52-16 BC52PA BC52-10PA BC52-16PA BCP52_BCX52_BC52PA Product data sheet BCP52; BCX52; BC52PA Ordering information [1] Package Name Description ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors 1.5 (1) P tot (W) (2) 1.0 (3) 0.5 0.0 –75 –25 25 (1) FR4 PCB, mounting pad for collector 6 cm (2) FR4 PCB, mounting pad for collector 1 cm (3) FR4 PCB, standard footprint Fig 1. Power derating curves SOT223 (1) FR4 PCB, 4-layer copper, mounting pad for collector 1 cm (2) FR4 PCB, single-sided copper, mounting pad for collector 6 cm ...
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... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 1 0. 0.5 0.33 0.2 0.1 10 0.05 0.02 0. –1 10 –5 – FR4 PCB, standard footprint Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0.1 10 0.05 0. 0.01 –1 10 –5 – FR4 PCB, mounting pad for collector 1 cm Fig 5 ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0.1 10 0.05 0. 0.01 –1 10 –5 – FR4 PCB, mounting pad for collector 6 cm Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values th(j-a) duty cycle = 1 (K/W) 0.75 0 0.33 0.2 0.1 0.05 10 0.02 0. –1 10 – ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 0. –1 10 –5 – FR4 PCB, mounting pad for collector 1 cm Fig 8. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values th(j-a) (K/W) 2 duty cycle = 1 10 0.75 0.5 0.33 0.2 0.1 10 0.05 0. 0.01 –1 10 – ...
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... NXP Semiconductors th(j-a) duty cycle = 1 (K/W) 0.75 0 0.33 0.25 0.2 0.1 0.05 10 0.02 0. –1 10 –5 – FR4 PCB, single-sided copper, standard footprint Fig 10. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.25 0.2 0.1 10 0.05 0.02 0. –1 10 –5 – ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.25 0.2 0.1 10 0.05 0. 0.01 –1 10 –5 – FR4 PCB, single-sided copper, mounting pad for collector 6 cm Fig 12. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.25 0.2 0.1 10 ...
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... NXP Semiconductors th(j-a) (K/ duty cycle = 1 0.75 0.5 0.33 0.25 0.2 10 0.1 0.05 0.02 1 0.01 0 –1 10 –5 – FR4 PCB, 4-layer copper, mounting pad for collector 1 cm Fig 14. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values 7. Characteristics Table amb Symbol ...
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... NXP Semiconductors 300 h FE (1) 200 (2) 100 (3) 0 –4 –3 –2 –10 –10 –10 –10 = 100 C (1) T amb = 25 C (2) T amb = 55 C (3) T amb Fig 15. DC current gain as a function of collector current; typical values –1 (V) (1) –0.8 ...
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... NXP Semiconductors 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline Fig 19. Package outline SOT223 (SC-73) Fig 20. Package outline SOT89 (SC-62/TO-243) ...
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... NXP Semiconductors Fig 21. Package outline SOT1061 (HUSON3) 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BCP52 BCX52 BC52PA [1] For further information and the availability of packing methods, see [2] Valid for all available selection groups. ...
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... NXP Semiconductors 11. Soldering 1.3 (4×) (4×) Fig 22. Reflow soldering footprint SOT223 (SC-73) 1.9 Fig 23. Wave soldering footprint SOT223 (SC-73) BCP52_BCX52_BC52PA Product data sheet 7 3.85 3.6 3.5 0.3 1 2.3 2.3 1.2 (3×) 1.3 (3×) 6.15 8.9 6 2.7 2.7 1.9 1.1 (2×) All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 October 2011 BCP52; BCX52; BC52PA PNP medium power transistors 3 ...
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... NXP Semiconductors 0.85 4.6 Fig 24. Reflow soldering footprint SOT89 (SC-62/TO-243) 7.6 Fig 25. Wave soldering footprint SOT89 (SC-62/TO-243) BCP52_BCX52_BC52PA Product data sheet BCP52; BCX52; BC52PA 4.75 2.25 2 1.9 1.2 0.2 1.2 1 (3×) 1.5 1.5 3.95 6.6 2.4 3.5 0.5 1.8 (2×) 1.9 1.9 1.5 0.7 (2×) 5.3 All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 October 2011 PNP medium power transistors 1 ...
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... NXP Semiconductors Fig 26. Reflow soldering footprint SOT1061 (HUSON3) BCP52_BCX52_BC52PA Product data sheet BCP52; BCX52; BC52PA 1.05 0.6 0.55 2.3 solder paste = solder lands solder resist Reflow soldering is the only recommended soldering method. All information provided in this document is subject to legal disclaimers. Rev. 9 — 18 October 2011 PNP medium power transistors 2 ...
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... NXP Semiconductors 12. Revision history Table 10. Revision history Document ID Release date BCP52_BCX52_BC52PA v.9 20111018 Modifications: BCP52_BCX52 v.8 20080225 BC638_BCP52_BCX52 v.7 20070626 BC638_BCP52_BCX52 v.6 20060329 BC636_638_640 v.5 20041011 BCP51_52_53 v.5 20030206 BCX51_52_53 v.4 20011010 BCP52_BCX52_BC52PA Product data sheet BCP52; BCX52; BC52PA Data sheet status Product data sheet • Added Type numbers: BC52PA, BC52-10PA and BC52-16PA • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 6 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . 14 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . 14 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 10 Packing information . . . . . . . . . . . . . . . . . . . . 15 11 Soldering ...