PZTA42 T/R NXP Semiconductors, PZTA42 T/R Datasheet

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PZTA42 T/R

Manufacturer Part Number
PZTA42 T/R
Description
Transistors Bipolar - BJT TRANS HV TAPE-7
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PZTA42 T/R

Product Category
Transistors Bipolar - BJT
Rohs
yes
Configuration
Single
Transistor Polarity
NPN
Collector- Base Voltage Vcbo
300 V
Collector- Emitter Voltage Vceo Max
300 V
Emitter- Base Voltage Vebo
6 V
Collector-emitter Saturation Voltage
6 V
Gain Bandwidth Product Ft
50 MHz
Dc Collector/base Gain Hfe Min
25 at 1 mA at 10 V
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOT-223
Continuous Collector Current
0.1 A
Maximum Power Dissipation
1200 mW
Minimum Operating Temperature
- 65 C
Factory Pack Quantity
1000
Part # Aliases
PZTA42,115
Product data sheet
Supersedes data of 1997 Jun 16
dbook, halfpage
DATA SHEET
PZTA42
NPN high-voltage transistor
DISCRETE SEMICONDUCTORS
M3D087
1999 May 21

Related parts for PZTA42 T/R

PZTA42 T/R Summary of contents

Page 1

DATA SHEET dbook, halfpage PZTA42 NPN high-voltage transistor Product data sheet Supersedes data of 1997 Jun 16 DISCRETE SEMICONDUCTORS M3D087 1999 May 21 ...

Page 2

... NXP Semiconductors NPN high-voltage transistor FEATURES • Low current (max. 100 mA) • High voltage (max. 300 V). APPLICATIONS • Telephony and professional communication equipment. DESCRIPTION NPN high-voltage transistor in a SOT223 plastic package. PNP complement: PZTA92. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). ...

Page 3

... NXP Semiconductors NPN high-voltage transistor THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to ambient th j-a R thermal resistance from junction to soldering point th j-s Note 1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated Handbook” ...

Page 4

... NXP Semiconductors NPN high-voltage transistor PACKAGE OUTLINE Plastic surface mounted package; collector pad for good heat transfer; 4 leads DIMENSIONS (mm are the original dimensions) A UNIT 1.8 0.10 0.80 3.1 mm 1.5 0.01 0.60 2.9 OUTLINE VERSION IEC SOT223 1999 May ...

Page 5

... NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. ...

Page 6

... NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www ...

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