BC869 /T3 NXP Semiconductors, BC869 /T3 Datasheet
BC869 /T3
Specifications of BC869 /T3
Related parts for BC869 /T3
BC869 /T3 Summary of contents
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... BCP69; BC869; BC69PA PNP medium power transistors Rev. 7 — 12 October 2011 1. Product profile 1.1 General description PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table 1. Type number BCP69 BC869 BC69PA [1] Valid for all available selection groups. 1.2 Features and benefits ...
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... NXP Semiconductors Table 2. Symbol h FE [1] Pulse test Pinning information Table 3. Pin SOT223 SOT89 SOT1061 BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA Quick reference data …continued Parameter Conditions = current gain 500 selection -16 ...
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... NXP Semiconductors 3. Ordering information Table 4. Type number BCP69 BC869 BC69PA [1] Valid for all available selection groups. 4. Marking Table 5. Type number BCP69 BCP69-16 BCP69-25 BC869 BC869-16 BC869-25 BC69PA BC69-16PA BC69-25PA BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA Ordering information [1] Package Name Description ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors 1.5 (1) P tot (W) (2) 1.0 (3) 0.5 0.0 –75 –25 25 (1) FR4 PCB, mounting pad for collector 6 cm (2) FR4 PCB, mounting pad for collector 1 cm (3) FR4 PCB, standard footprint Fig 1. Power derating curves SOT223 (1) FR4 PCB, 4-layer copper, mounting pad for collector 1 cm (2) FR4 PCB, single-sided copper, mounting pad for collector 6 cm ...
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... NXP Semiconductors 6. Thermal characteristics Table 7. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 1 0. 0.5 0.33 0.2 0.1 10 0.05 0.02 0. –1 10 –5 – FR4 PCB, standard footprint Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0.1 10 0.05 0. 0.01 –1 10 –5 – FR4 PCB, mounting pad for collector 1 cm Fig 5 ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0.1 10 0.05 0. 0.01 –1 10 –5 – FR4 PCB, mounting pad for collector 6 cm Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT223; typical values th(j-a) duty cycle = 1 (K/W) 0.75 0 0.33 0.2 0.1 0.05 10 0.02 0. –1 10 – ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 0. –1 10 –5 – FR4 PCB, mounting pad for collector 1 cm Fig 8. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT89; typical values th(j-a) (K/W) 2 duty cycle = 1 10 0.75 0.5 0.33 0.2 0.1 10 0.05 0. 0.01 –1 10 – ...
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... NXP Semiconductors th(j-a) duty cycle = 1 (K/W) 0.75 0 0.33 0.25 0.2 0.1 0.05 10 0.02 0. –1 10 –5 – FR4 PCB, single-sided copper, standard footprint Fig 10. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.25 0.2 0.1 10 0.05 0.02 0. –1 10 –5 – ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.25 0.2 0.1 10 0.05 0. 0.01 –1 10 –5 – FR4 PCB, single-sided copper, mounting pad for collector 6 cm Fig 12. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.25 0.2 0.1 10 ...
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... NXP Semiconductors th(j-a) (K/ duty cycle = 1 0.75 0.5 0.33 0.25 0.2 10 0.1 0.05 0.02 1 0.01 0 –1 10 –5 – FR4 PCB, 4-layer copper, mounting pad for collector 1 cm Fig 14. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA – ...
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... NXP Semiconductors 7. Characteristics Table amb Symbol I CBO I EBO CEsat [1] Pulse test: t BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA Characteristics C unless otherwise specified. Parameter Conditions = collector-base cut-off V CB current = 150 C ...
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... NXP Semiconductors 300 h FE (1) 200 (2) 100 ( -10 -10 -10 = 100 C (1) T amb = 25 C (2) T amb = 55 C (3) T amb Fig 15. h selection -16: DC current gain function of collector current; typical values -1 (V) (1) -0.8 (2) (3) -0.4 0.0 -1 -10 -1 -10 = 1 V ...
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... NXP Semiconductors 400 ( 300 (2) 200 (3) 100 -10 -10 -10 = 100 C (1) T amb = 25 C (2) T amb = 55 C (3) T amb Fig 19. h selection -25: DC current gain function of collector current; typical values -1 (V) (1) -0.8 (2) (3) -0.4 0.0 -1 -10 -1 -10 = 1 V ...
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... NXP Semiconductors 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline Fig 23. Package outline SOT223 (SC-73) Fig 24. Package outline SOT89 (SC-62/TO-243) ...
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... NXP Semiconductors Fig 25. Package outline SOT1061 (HUSON3) 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BCP69 BC869 BC69PA [1] For further information and the availability of packing methods, see [2] Valid for all available selection groups. ...
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... NXP Semiconductors 11. Soldering 1.3 (4×) (4×) Fig 26. Reflow soldering footprint SOT223 (SC-73) 1.9 Fig 27. Wave soldering footprint SOT223 (SC-73) BCP69_BC869_BC69PA Product data sheet 7 3.85 3.6 3.5 0.3 1 2.3 2.3 1.2 (3×) 1.3 (3×) 6.15 8.9 6 2.7 2.7 1.9 1.1 (2×) All information provided in this document is subject to legal disclaimers. Rev. 7 — 12 October 2011 BCP69; BC869; BC69PA PNP medium power transistors 3 ...
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... NXP Semiconductors 0.85 4.6 Fig 28. Reflow soldering footprint SOT89 (SC-62/TO-243) 7.6 Fig 29. Wave soldering footprint SOT89 (SC-62/TO-243) BCP69_BC869_BC69PA Product data sheet BCP69; BC869; BC69PA 4.75 2.25 2 1.9 1.2 0.2 1.2 1 (3×) 1.5 1.5 3.95 6.6 2.4 3.5 0.5 1.8 (2×) 1.9 1.9 1.5 0.7 (2×) 5.3 All information provided in this document is subject to legal disclaimers. Rev. 7 — 12 October 2011 PNP medium power transistors 1 ...
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... NXP Semiconductors Fig 30. Reflow soldering footprint SOT1061 (HUSON3) BCP69_BC869_BC69PA Product data sheet 1.05 0.6 0.55 2.3 solder paste = solder lands solder resist Reflow soldering is the only recommended soldering method. All information provided in this document is subject to legal disclaimers. Rev. 7 — 12 October 2011 BCP69; BC869; BC69PA PNP medium power transistors 2 ...
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... Product data sheet Data sheet status Product data sheet • The format of this document has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Type number BC69PA added • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 6 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . 16 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . 16 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 10 Packing information . . . . . . . . . . . . . . . . . . . . 17 11 Soldering ...