BUK7611-55B /T3 NXP Semiconductors, BUK7611-55B /T3 Datasheet - Page 5

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BUK7611-55B /T3

Manufacturer Part Number
BUK7611-55B /T3
Description
MOSFET HIGH PERF TRENCHMOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK7611-55B /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
55 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
84 A
Resistance Drain-source Rds (on)
0.011 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
27 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
157 W
Rise Time
45 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
41 ns
Part # Aliases
BUK7611-55B,118
NXP Semiconductors
5. Thermal characteristics
Table 5.
BUK7611-55B
Product data sheet
Symbol
R
R
Fig 4.
th(j-mb)
th(j-a)
Transient thermal impedance from junction to mounting base as a function of pulse duration
Thermal characteristics
Parameter
thermal resistance from
junction to mounting base
thermal resistance from
junction to ambient
Z
(K/W)
th(j-mb)
10
10
10
−1
−2
−3
1
10
−6
δ = 0.5
single shot
0.05
0.02
0.2
0.1
10
−5
All information provided in this document is subject to legal disclaimers.
10
Rev. 3 — 31 January 2011
Conditions
see
minimum footprint; mounted on
a printed-circuit board
−4
Figure 4
10
−3
10
−2
N-channel TrenchMOS standard level FET
P
10
t
−1
p
T
t
p
BUK7611-55B
Min
-
-
(s)
δ =
03nn45
t
T
t
p
1
Typ
-
50
© NXP B.V. 2011. All rights reserved.
Max
0.95
-
Unit
K/W
K/W
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