BUK9609-40B /T3 NXP Semiconductors, BUK9609-40B /T3 Datasheet - Page 9

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BUK9609-40B /T3

Manufacturer Part Number
BUK9609-40B /T3
Description
MOSFET HIGH PERF TRENCHMOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK9609-40B /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
95 A
Resistance Drain-source Rds (on)
0.007 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
89 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
157 W
Rise Time
106 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
108 ns
Part # Aliases
BUK9609-40B,118
NXP Semiconductors
BUK9609-40B
Product data sheet
Fig 13. Gate-source voltage as a function of gate
Fig 15. Source current as a function of source-drain voltage; typical values
V
(V)
GS
5
4
3
2
1
0
charge; typical values
0
V
10
DD
= 14 V
20
V
DD
(A)
I
S
100
= 32 V
75
50
25
30
0
0.0
All information provided in this document is subject to legal disclaimers.
Q
G
03nm58
(nC)
40
0.3
Rev. 02 — 7 June 2010
T
j
= 175 ° C
0.6
Fig 14. Input, output and reverse transfer capacitances
(pF)
C
5000
3750
2500
1250
0.9
0
10
T
as a function of drain-source voltage; typical
values
j
−2
= 25 ° C
V
SD
03nm57
(V)
N-channel TrenchMOS logic level FET
1.2
10
−1
C
C
C
iss
oss
rss
BUK9609-40B
1
10
© NXP B.V. 2010. All rights reserved.
V
DS
03nm64
(V)
10
2
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