PMF170XP,115 NXP Semiconductors, PMF170XP,115 Datasheet
PMF170XP,115
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PMF170XP,115 Summary of contents
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PMF170XP P-channel Trench MOSFET Rev. 1 — 2 September 2011 1. Product profile 1.1 General description P-channel enhancement mode Field-Effect Transistor (FET SOT323 (SC-70) small Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. ...
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... NXP Semiconductors 3. Ordering information Table 3. Ordering information Type number Package Name PMF170XP SC-70 4. Marking Table 4. Marking codes Type number PMF170XP [ placeholder for manufacturing site code 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V drain-source voltage ...
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... NXP Semiconductors 120 P der (%) −75 −25 25 Fig 1. Normalized total power dissipation as a function of junction temperature –10 Limit R I DSon D (A) –1 -1 –10 -2 –10 -1 – single pulse (3) DC ° 100 ms p (5) DC °C; drain mounting pad 6 cm amb Fig 3 ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter R thermal resistance th(j-a) from junction to ambient R thermal resistance th(j-sp) from junction to solder point [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm ...
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... NXP Semiconductors 7. Characteristics Table 7. Characteristics Symbol Parameter Static characteristics V drain-source (BR)DSS breakdown voltage V gate-source threshold GSth voltage I drain leakage current DSS I gate leakage current GSS R drain-source on-state DSon resistance g forward fs transconductance Dynamic characteristics Q total gate charge G(tot) Q gate-source charge GS Q gate-drain charge ...
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... NXP Semiconductors –4 –4 –3 (A) –3.0 V –3 –2.5 V –2.0 V –2 –1.8 V –1 –1 –1 – °C j Fig 6. Output characteristics: drain current as a function of drain-source voltage; typical values 500 R DSon (mΩ) 400 300 200 100 0 –2.0 –2.5 – ...
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... NXP Semiconductors – (A) –3 –2 –1 ( –1 V > I × DSon ( ° 150 °C j Fig 10. Transfer characteristics: drain current as a function of gate-source voltage; typical values −1.6 V GS(th) (V) (1) −1.2 (2) −0.8 (3) −0.4 0.0 − -0.25 mA (1) maximum values ...
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... NXP Semiconductors – (V) –4 –3 –2 – -1 - Fig 14. Gate-source voltage as a function of gate charge; typical values ( 150 ° °C j Fig 16. Source current as a function of source-drain voltage; typical values PMF170XP Product data sheet ...
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... NXP Semiconductors 8. Test information Fig 17. Duty cycle definition PMF170XP Product data sheet duty cycle δ 006aaa812 All information provided in this document is subject to legal disclaimers. Rev. 1 — 2 September 2011 PMF170XP P-channel Trench MOSFET © NXP B.V. 2011. All rights reserved. ...
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... NXP Semiconductors 9. Package outline Plastic surface-mounted package; 3 leads DIMENSIONS (mm are the original dimensions UNIT b p max 1.1 0.4 0.25 mm 0.1 0.8 0.3 0.10 OUTLINE VERSION IEC SOT323 Fig 18. Package outline SOT323 (SC-70) PMF170XP Product data sheet scale ...
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... NXP Semiconductors 10. Soldering 0.6 2.35 (3×) Fig 19. Reflow soldering footprint for SOT323 (SC-70) 1.425 (3×) 3.65 2.1 Fig 20. Wave soldering footprint for SOT323 (SC-70) PMF170XP Product data sheet 2.65 1.85 1.325 2 3 1.3 0.5 1 (3×) 0.55 (3×) 4.6 2.575 All information provided in this document is subject to legal disclaimers. Rev. 1 — 2 September 2011 PMF170XP ...
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... NXP Semiconductors 11. Revision history Table 8. Revision history Document ID Release date PMF170XP v.1 20110902 PMF170XP Product data sheet Data sheet status Change notice Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 1 — 2 September 2011 PMF170XP P-channel Trench MOSFET ...
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... NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 14. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . .4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . .9 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10 10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . .12 12 Legal information ...