BZX100A T/R NXP Semiconductors, BZX100A T/R Datasheet

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BZX100A Single Zener diode Rev. 01 — 30 May 2007 1. Product profile 1.1 General description General-purpose Zener diode in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features I Non-repetitive peak reverse power ...

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... NXP Semiconductors 3. Ordering information Table 3. Type number BZX100A 4. Marking Table 4. Type number BZX100A 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol ZSM P ZSM P tot amb T stg [ 100 s; square wave [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...

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... NXP Semiconductors (1) Ceramic PCB, Al (2) FR4 PCB, mounting pad for cathode 1 cm (3) FR4 PCB, standard footprint Fig 1. Power derating curves 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm ...

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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. j Symbol dif [1] Pulse test ZSM ( (prior to surge) j Fig 2. Non-repetitive peak reverse power dissipation as a function of pulse duration; maximum ...

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... NXP Semiconductors 150 S Z (mV/K) 140 130 120 110 100 150 C j Fig 4. Temperature coefficient as a function of working current; typical values 8. Application information High-voltage Zener diodes can be used as overvoltage protection diodes for Integrated Circuits (IC) due to their ability to cut off the applied voltage at a well-defined value. One important application is the protection of EL driver circuits where a driver IC is connected foil ...

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... NXP Semiconductors 9. Test information 9.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 (Stress qualification for discrete semiconductors) and is suitable for use in automotive critical applications. 10. Package outline Fig 7. Package outline SOD323F (SC-90) 11. Packing information Table 8 ...

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... NXP Semiconductors 12. Soldering Fig 8. Reflow soldering footprint SOD323F (SC-90) BZX100A_1 Product data sheet 3.05 2.80 2.10 1.60 1.65 0.95 0. Reflow soldering is the only recommended soldering method. Dimensions in mm Rev. 01 — 30 May 2007 BZX100A Single Zener diode solder lands solder resist 0.50 0.60 occupied area solder paste msa433 © NXP B.V. 2007. All rights reserved. ...

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... NXP Semiconductors 13. Revision history Table 9. Revision history Document ID Release date BZX100A_1 20070530 BZX100A_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 30 May 2007 BZX100A Single Zener diode Supersedes - © NXP B.V. 2007. All rights reserved ...

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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...

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... NXP Semiconductors 16. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Application information Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 9.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Packing information ...