MT47H32M8BP-37E:B TR Micron Technology Inc, MT47H32M8BP-37E:B TR Datasheet - Page 3

• Manufacturer Part Number: MT47H32M8BP-37E:B TR
• Description: IC DDR2 SDRAM 256MBIT 60FBGA
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr

Specifications of MT47H32M8BP-37E:B TR

• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 256M (32M x 8)
• Speed: 3.75ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 60-FBGA
• Organization: 32Mx8
• Density: 256Mb
• Address Bus: 15b
• Access Time (max): 500ps
• Maximum Clock Rate: 533MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 160mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1049-2

Contents
State Diagram .................................................................................................................................................. 8
Functional Description ..................................................................................................................................... 9
Functional Block Diagrams ............................................................................................................................. 11
Ball Assignments and Descriptions ................................................................................................................. 13
Packaging ...................................................................................................................................................... 17
Electrical Specifications – Absolute Ratings ..................................................................................................... 20
Electrical Specifications – I
AC Timing Operating Specifications ................................................................................................................ 26
AC and DC Operating Conditions .................................................................................................................... 37
ODT DC Electrical Characteristics ................................................................................................................... 38
Input Electrical Characteristics and Operating Conditions ............................................................................... 39
Output Electrical Characteristics and Operating Conditions ............................................................................. 42
Output Driver Characteristics ......................................................................................................................... 44
Power and Ground Clamp Characteristics ....................................................................................................... 48
AC Overshoot/Undershoot Specification ......................................................................................................... 49
Input Slew Rate Derating ................................................................................................................................ 51
Commands .................................................................................................................................................... 64
Mode Register (MR) ........................................................................................................................................ 70
Extended Mode Register (EMR) ....................................................................................................................... 75
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
Industrial Temperature ................................................................................................................................ 9
Automotive Temperature ........................................................................................................................... 10
General Notes ............................................................................................................................................ 10
Package Dimensions .................................................................................................................................. 17
FBGA Package Capacitance ......................................................................................................................... 19
Temperature and Thermal Impedance ........................................................................................................ 20
I
I
Truth Tables ............................................................................................................................................... 64
DESELECT ................................................................................................................................................. 68
NO OPERATION (NOP) .............................................................................................................................. 69
LOAD MODE (LM) ..................................................................................................................................... 69
ACTIVATE .................................................................................................................................................. 69
READ ......................................................................................................................................................... 69
WRITE ....................................................................................................................................................... 69
PRECHARGE .............................................................................................................................................. 70
REFRESH ................................................................................................................................................... 70
SELF REFRESH ........................................................................................................................................... 70
Burst Length .............................................................................................................................................. 71
Burst Type ................................................................................................................................................. 72
Operating Mode ......................................................................................................................................... 72
DLL RESET ................................................................................................................................................. 72
Write Recovery ........................................................................................................................................... 73
Power-Down Mode .................................................................................................................................... 73
CAS Latency (CL) ........................................................................................................................................ 74
DLL Enable/Disable ................................................................................................................................... 76
Output Drive Strength ................................................................................................................................ 76
DQS# Enable/Disable ................................................................................................................................. 76
RDQS Enable/Disable ................................................................................................................................. 76
Output Enable/Disable ............................................................................................................................... 76
On-Die Termination (ODT) ........................................................................................................................ 77
DD
DD7
Specifications and Conditions ............................................................................................................... 23
Conditions .......................................................................................................................................... 23
DD
Parameters ........................................................................................................ 23
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 DDR2 SDRAM
©2003 Micron Technology, Inc. All rights reserved.