CY7C1360C-200AXC Cypress Semiconductor Corp, CY7C1360C-200AXC Datasheet - Page 33

• Manufacturer Part Number: CY7C1360C-200AXC
• Description: IC SRAM 9MBIT 200MHZ 100LQFP
• Manufacturer: Cypress Semiconductor Corp
• Type: Synchronousr

Specifications of CY7C1360C-200AXC

• Memory Size: 9M (256K x 36)
• Package / Case: 100-LQFP
• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 3.135 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Access Time: 3 ns
• Maximum Clock Frequency: 200 MHz
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3.135 V
• Maximum Operating Current: 220 mA
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Number Of Ports: 4
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 428-2126; CY7C1360C-200AXC

Document History Page
Document Number: 38-05540 Rev. *K
Document Title: CY7C1360C/CY7C1362C 9-Mbit (256 K × 36/512 K × 18)
Pipelined SRAM
Document Number: 38-05540
REV.
*C
*D
*G
*H
*A
*B
*E
*F
**
ECN NO.
241690
278130
248929
323636
332879
357258
377095
408298
501793
Submission
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
See ECN
Date
Orig. of
Change
RKF
RKF
RXU
VKN
VBL
PCI
PCI
PCI
PCI
New data sheet
Changed Boundary Scan order to match the B rev of these devices
Changed TQFP pkg to Lead-free TQFP in Ordering Information section
Added comment of Lead-free BG and BZ packages availability
Changed ISB1 and ISB3 from DC Characteristics table as follows:
ISB1: 225 MHz -> 130 mA, 200 MHz -> 120 mA, 167 MHz -> 110 mA
ISB3: 225 MHz -> 120 mA, 200 MHz -> 110 mA, 167 MHz -> 100 mA
Changed IDDZZ to 50 mA
Added BG and BZ pkg lead-free part numbers to ordering info section
Added t
Changed Θ
6.13 °C/W respectively
Changed Θ
14.0 °C/W respectively
Changed Θ
3.0 °C/W respectively
Modified address expansion as per JEDEC Standard
Removed comment of Lead-free BG and BZ packages availability
Unshaded 200 and 166 MHz speed bins in the AC/DC Table and Selection
Guide
Added Address Expansion pins in the Pin Definition Table
Changed Device Width (23:18) for 119-BGA from 000000 to 101000
Added separate row for 165 -FBGA Device Width (23:18)
Modified V
Updated Ordering Information Table
Changed from Preliminary to Final
Removed Shading on 250MHz Speed Bin in Selection Guide and AC/DC
Table
Changed I
Updated Ordering Information Table
“3901 North First Street” to “198 Champion Court”
Changed three
Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in
the Electrical Characteristics Table
Replaced Package Name column with Package Diagram in the Ordering
Information table
Updated Ordering Information Table
Added the Maximum Rating for Supply Voltage on V
Changed t
AC Switching Characteristics table.
Updated the Ordering Information table.
Changed frequency of 225 MHz into 250 MHz
Modified test condition in note# 16 from V
Changed address of Cypress Semiconductor Corporation on Page# 1 from
CYC
SB2
TH
OL
JA
JA
JA
of 4.0 ns for 250 MHz
, t
, V
and Θ
and Θ
and Θ
from 30 to 40 mA
TL
-
OH
state to tri-state on page# 9 & page# 10
from 25 ns to 20 ns and t
test conditions
JC
JC
JC
for TQFP Package from 25 and 9 °C/W to 29.41 and
for BGA Package from 25 and 6 °C/W to 34.1 and
for FBGA Package from 27 and 6 °C/W to 16.8 and
Description of Change
CY7C1360C, CY7C1362C
DDQ
TDOV
< V
from 5 ns to 10 ns in TAP
DD
DDQ
to V
DDQ
Relative to GND
≤ V
Page 33 of 34
DD
[+] Feedback