CY7C1020DV33-10ZSXI Cypress Semiconductor Corp, CY7C1020DV33-10ZSXI Datasheet - Page 3

• Manufacturer Part Number: CY7C1020DV33-10ZSXI
• Description: IC SRAM 512KBIT 10NS 44TSOP
• Manufacturer: Cypress Semiconductor Corp
• Type: Asynchronousr

Specifications of CY7C1020DV33-10ZSXI

• Memory Size: 512K (32K x 16)
• Package / Case: 44-TSOP II
• Format - Memory: RAM
• Memory Type: SRAM - Asynchronous
• Speed: 10ns
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Access Time: 10 ns
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Maximum Operating Current: 60 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Number Of Ports: 1
• Operating Supply Voltage: 3.3 V
• Memory Configuration: 32K X 16
• Supply Voltage Range: 3V To 3.6V
• Memory Case Style: TSOP
• No. Of Pins: 44
• Operating Temperature Range: -40°C To +85°C
• Rohs Compliant: Yes
• Density: 512Kb
• Access Time (max): 10ns
• Sync/async: Asynchronous
• Architecture: Not Required
• Clock Freq (max): Not RequiredMHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 15b
• Package Type: TSOP-II
• Operating Temp Range: -40C to 85C
• Supply Current: 60mA
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Word Size: 16b
• Number Of Words: 32K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 428-1970; CY7C1020DV33-10ZSXI

Document #: 38-05461 Rev. *F
AC Test Loads and Waveforms
Notes
Capacitance
Thermal Resistance
C
C
5. Tested initially and after any design or process changes that may affect these parameters.
6. AC characteristics (except High-Z) are tested using the load conditions shown in Figure (a). High-Z characteristics are tested for all speeds using the test load
Parameter
Parameter
IN
OUT
shown in Figure (c).
* CAPACITIVE LOAD CONSISTS
OF ALL COMPONENTS OF THE
TEST ENVIRONMENT


JC
JA
OUTPUT
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Input Capacitance
Output Capacitance
[5]
Description
Description
[5]
Z = 50
(a)
1.5V
50 
[6]
T
Still Air, soldered on a 3 × 4.5 inch,
four-layer printed circuit board
A
= 25C, f = 1 MHz, V
High-Z characteristics:
OUTPUT
Test Conditions
3.3V
30 pF*
Test Conditions
5 pF
CC
(c)
= 3.3V
R 317
GND
3.0V
Rise Time: 1 V/ns
351
R2
59.52
36.75
SOJ
10%
90%
ALL INPUT PULSES
(b)
Max.
TSOP II
53.91
21.24
8
8
CY7C1020DV33
Fall Time: 1 V/ns
90%
10%
Page 3 of 12
Unit
C/W
C/W
pF
pF
Unit
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