M24C02-WBN6P STMicroelectronics, M24C02-WBN6P Datasheet - Page 23

• Manufacturer Part Number: M24C02-WBN6P
• Description: IC EEPROM 2KBIT 400KHZ 8DIP
• Manufacturer: STMicroelectronics

Specifications of M24C02-WBN6P

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 2K (256 x 8)
• Speed: 400kHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Organization: 256 K x 8
• Interface Type: I2C
• Maximum Clock Frequency: 0.4 MHz
• Access Time: 900 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 2 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 6.5 V
• Capacitance, Input: 8 pF (SDA), 6 pF (Other Pins)
• Current, Input, Leakage: ±2 μA
• Current, Operating: 2 mA
• Current, Output, Leakage: ±2
• Data Retention: >40 yrs.
• Density: 2K
• Package Type: PDIP8
• Temperature, Operating: -40 to +85 °C
• Time, Access: 900 ns
• Time, Fall: 50 ns
• Time, Rise: 50 ns
• Voltage, Esd: 4000 V
• Voltage, Input, High: 3.5 to 6.5 V
• Voltage, Input, Low: 0.75 to 1.65 V
• Voltage, Output, Low: 0.4 V
• Voltage, Supply: 2.5 to 5.5 V
• Memory Configuration: 256 X 8
• Clock Frequency: 400kHz
• Supply Voltage Range: 2.5V To 5.5V
• Memory Case Style: DIP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8584-5; M24C02-WBN6P

Figure 15. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm²,
Outline
Note: 1. Drawing is not to scale.
Table 17. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm²,
Data
N (number of
Symbol
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V
3. The circle in the top view of the package indicates the position of pin 1.
pins)
ddd
D2
A1
E2
L1
L3
A
D
E
b
e
L
any other voltage or signal line on the PCB, for example during the soldering process.
Typ.
0.55
0.25
2.00
3.00
0.50
0.45
A
E
A1
millimeters
Min.
0.50
0.00
0.20
1.55
0.15
0.40
0.30
–
8
D
Max.
0.60
0.05
0.30
1.65
0.05
0.25
0.50
0.15
M24C16, M24C08, M24C04, M24C02, M24C01
ddd
–
L3
0.022
0.010
0.079
0.118
0.020
0.018
Typ.
D2
e
SS
b
. It must not be allowed to be connected to
UFDFPN-01
L1
E2
L
inches
0.020
0.000
0.008
0.061
0.006
0.016
0.012
Min.
–
8
0.024
0.002
0.012
0.065
0.002
0.010
0.020
0.006
Max.
–
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